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US 2001/0040296 A1Published application
Printed-circuit board and method of mounting electric components thereon
OwnerKatsuaki Hiromatsuinventor
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OwnerKatsuaki Hiromatsuinventor
Estimating the term…
It is an object of the invention to provide a low cost printed-circuit board capable of achieving high density of mounting of the surface mounting components and of designing of conductive patterns while keeping speeding up a transmission speed of a signal pattern and reducing a noise, and a method of mounting electric components on the printed-circuit board. Component mounting pads formed of conductive patterns are disposed on a surface of the printed-circuit board at two locations thereof, and through holes for connecting printed-circuit boards of a multi-layer printed-circuit board are defined in the component mounting pads. The through holes are filled up by a resist ink from the electric component non-mounting surface when the printed-circuit board is manufactured. As a result, a sealed air-layer is formed inside the through holes when a solder is pasted or soldered onto the printed-circuit board.
A printed-circuit board comprising electric component mounting pads each having a through hole for connecting between printed-circuit boards of a multi-layer printed-circuit board wherein the electric components are mounted on the electric component mounting pads by way of a solder, wherein the through holes are filled up and blocked by a filling-up material from the side where the electric components are not mounted.
A method of mounting electric components on a printed-circuit board comprising the steps of:
Dependencies are inferred from the claim text.