Method of manufacturing semiconductor device and method of manufacturing film carrier tape
AssigneeSeiko Epson Corporation
InventorNobuaki Hashimoto
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Abstract
The present invention is a semiconductor device with improved adhesion properties of a resin with a wiring pattern, comprising a film fragment 14 having a patterned wiring pattern 16 including a projection 17, a semiconductor chip 12 having electrodes 13 bonded to the projection 17, and a resin 19 provided to the wiring pattern 16 in the region other than that of the projection 17; and the wiring pattern 16 has its surface of contact with the resin 19 roughened.
Claims9
A semiconductor device comprising:
- an insulating film having a wiring pattern;
- a semiconductor chip having electrodes bonded to said wiring pattern;
- and
- a resin provided on said wiring pattern, said wiring pattern having a first surface opposed to said insulating film and a second surface opposed to said semiconductor chip with said resin interposed therebetween, said second surface having irregularities formed thereon.
A semiconductor device comprising:
- an insulating film having a wiring pattern;
- a semiconductor chip having electrodes bonded to said wiring pattern;
- and
- a resin provided on said wiring pattern, said wiring pattern having a first surface opposed to said insulating film and a second surface opposed to said semiconductor chip with said resin interposed therebetween, each of said first and second surfaces having irregularities formed thereon.
A semiconductor device obtained by a method comprising:
- a first step of forming on an insulating film a wiring pattern, at least a part of which is subjected to roughening processing;
- and
- a second step in which on a surface of said wiring pattern subjected to roughening processing, at least one application of resin is made.
A semiconductor device comprising:
- a semiconductor chip having electrodes;
- an insulating film having a wiring pattern, said wiring pattern including projections facing and bonded to said electrodes;
- and
- a resin provided on said wiring pattern, said wiring pattern facing an active surface of said semiconductor chip, a surface of said wiring pattern contacted with said resin,
- wherein regions in said wiring pattern facing said active surface of said semiconductor chip, other than upper surfaces of said projections, are roughened to have a wider surface area than a smooth surface.
A film carrier tape obtained by a method comprising a step of forming on an insulating film a wiring pattern, at least a part of which is subjected to roughening processing for adhesion to resin,
- wherein said step of forming a wiring pattern comprises:
- a step of forming a metal film on said insulating film;
- and
- thereafter in any order, steps of patterning said metal film to form said wiring pattern, and of applying roughening processing to at least a part of said metal film.
Dependencies are inferred from the claim text.