Method for forming bump, semiconductor device and method for making the same, circuit board, and electronic device
AssigneeSeiko Epson Corporation
InventorsKazunori Sakurai, Tsutomu Ota, Fumiaki Matsushima, Akira Makabe
Life of this patent
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Abstract
The invention provides a method for readily forming a bump with a desired width, a semiconductor device and a method for making the same, a circuit board, and an electronic device. A method for forming a bump includes forming an opening in an insulating film which exposes at least a part of a pad, and forming the bump so as to be connected to the pad. A resist layer 20 defines a through hole which extends over at least a part of the pad in plan view. A metal layer is formed in the opening so as to connect to the exposed portion of the pad.
Claims32
A method for forming a bump, comprising:
- forming an opening in an insulating film which exposes at least a part of a pad;
- forming a bump connected to the pad;
- forming a resist layer that defines a through hole which overlaps at least a portion of the pad;
- and
- forming a metal layer connected to the portion of the pad exposed at the opening.
A semiconductor device, comprising:
- a semiconductor chip having a plurality of pads;
- an insulating film formed on the semiconductor chip so that the insulating film covers at least an end of each of the pads, and the pads have regions which are not covered with the insulating film;
- and
- a bump formed on each pad, the bump including a first metal layer formed in the region of the pads not covered with the insulating film so as to be spaced from the insulating film, and a second metal layer formed so as to cover the first metal layer and contact the insulating layer.
A semiconductor device, comprising:
- a semiconductor chip having a plurality of pads;
- an insulating film formed on the semiconductor chip so that the insulating film covers at least an end of each of the pads, and the pads have regions which are not covered with the insulating film;
- and
- a bump formed on each pad, the bump being formed to have an end that is disposed on the insulating film, the bump covering the region of the pads, the thickness of a portion of the insulating film that is laterally spaced from the pads being larger than a portion that is below the bump.
A semiconductor device, comprising:
- a semiconductor chip having a plurality of pads;
- and
- a bump that includes a pillar shaped body connected to each of the pads and a tip connected to the body, the tip having a width which is larger than a width of the body, the bump having a space for holding a solder between the tip and the body.
Dependencies are inferred from the claim text.