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US 2001/0040289 A1Published application
Semiconductor device and the method for manufacturing the same
AssigneeOki Electric Industry Co., Ltd.
InventorKaname Kobayashi
Life of this patent
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Abstract
A semiconductor device includes a semiconductor chip having a bump electrode over its main surface. The bump electrode has at least one protrusion on the top surface thereof. A lead is electrically connected to the top surface of the bump electrode, and is positioned adjacent to the protrusion.
Claims11
A semiconductor device comprising:
- a semiconductor chip having a main surface;
- a bump electrode having the bottom surface over main surface of said semiconductor chip, said bump electrode further having a top surface opposite said bottom surface and a first protrusion extending upwardly from said top surface;
- and
- a lead electrically connected to said bump electrode;
- wherein said lead has a bottom surface which faces towards said top surface of said bump electrode and which is located below a top of said first protrusion.
2 more elements
A method for manufacturing a semiconductor device, comprising:
- forming a pad electrode over a main surface of a semiconductor chip;
- sequentially forming a first insulating layer and a second insulating layer over a peripheral region of said pad electrode, wherein a non-peripheral region of said pad electrode remains exposed;
- forming a metal layer over at least portions of said non-peripheral region of said pad electrode and said second insulating;
- forming a bump electrode on said metal layer.
1 more element
A method for manufacturing a semiconductor device having a bump electrode, comprising:
- forming a bump electrode;
- shaping a top surface of the bump electrode using a shaping tool;
- wherein the top surface is shaped to make a peripheral portion of the top surface of the bump electrode higher than a central portion of the top surface of the bump electrode.
A method for manufacturing a semiconductor device having bump electrodes, comprising:
- positioning a plurality portions of a tool to form partitions between respective adjacent bump electrodes;
- and
- connecting a plurality of leads to the bump electrodes, respectively, while the plurality of portions form partitions between the respective adjacent bump electrodes.
Dependencies are inferred from the claim text.