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US 2001/0040288 A1Published application
Packaged semiconductor device and manufacturing method thereof
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsHironori Matsushima, Yoshihiro Tomita
Life of this patent
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Abstract
A semiconductor chip is attached on a package substrate so as to be electrically connected to it and sealed. A ring member is attached to the package substrate and surrounds the semiconductor chip. A lid member is attached to the ring member and covers the semiconductor chip. The lid member is formed so as to be able to be removed from the ring member without impairing the attachment of the ring member to the package substrate.
Claims5
A semiconductor device comprising:
- a package substrate;
- a semiconductor chip attached to said package substrate so as to be electrically connected to said package substrate and sealed;
- a ring member that is attached to said package substrate surrounding said semiconductor chip;
- and
- a lid member that is attached to said ring member to cover said semiconductor chip, said lid member being formed so as to be able to be removed from said ring member without impairing attachment of said ring member to said package substrate.
2 more elements
Dependencies are inferred from the claim text.