Semiconductor device and method for the fabrication thereof

A method for the fabrication of a semiconductor device comprising the steps of:

• (a) preparing a frame member;
• said frame member including:
• a plate-like frame major portion having a top surface and a bottom surface;
• a plurality of electrode constituent portions which are projections formed on said top surface of said frame major portion;
• and
• an element housing portion located in a top surface area of said frame major portion surrounded by said plural electrode constituent portions, said element housing portion housing therein a semiconductor element to be fixed thereto;
• (b) fixing to said element housing portion of said frame member said semiconductor element having a plurality of electrodes;
• (c) after said step (b), electrically connecting by a fine wire between at least one of said plural electrodes of said semiconductor element and at least one of top surfaces of said plural electrode constituent portions;
• (d) encapsulating, by a resin, a surface of said frame member on the side where said semiconductor element has been fixed to said element housing portion and has been electrically connected by said fine wire;
• and
• (e) after said step (d), grinding said frame major portion of said frame member such that said plural electrode constituent portions are separated from each other to become individual external electrodes, and exposing both a bottom surface of each of said plural external electrodes and a bottom surface of said semiconductor element from said resin.

A semiconductor device comprising:

• a semiconductor element having a plurality of electrodes;
• a plurality of external electrodes disposed around the periphery of said semiconductor element, each of said plural external electrodes having at its top surface a projecting stepped portion and a projected portion;
• a fine wire electrically connected between a surface of at least one of said projecting stepped portions of said plural external electrodes and at least one of said plural electrodes of said semiconductor element;
• and
• an encapsulating resin which encapsulates said semiconductor element, said plural external electrodes, and said fine wire and whose external shape is a rectangular parallelepiped;
• wherein both a bottom surface of said semiconductor element and a bottom surface of each of said plural external electrodes are exposed from a bottom surface of said encapsulating resin;
• wherein a top surface of said semiconductor element and a top surface of each of said projecting stepped portions of said plural external electrodes are located substantially coplanar with each other;
• and
• wherein each of said projected portions of said plural external electrodes is exposed from a top surface of said encapsulating resin.

A method for the fabrication of a semiconductor device comprising the steps of:

• (a) preparing a frame member;
• said frame member including:
• a plate-like frame major portion having a top surface and a bottom surface;
• a plurality of electrode constituent portions which are projections formed on said top surface of said frame major portion, each of said plural electrode constituent portions having at its top surface a projecting stepped portion and a projected portion;
• and
• an element housing portion located in a top surface area of said frame major portion surrounded by said plural electrode constituent portions, said element housing portion housing therein a semiconductor element to be fixed thereto;
• (b) fixing to said element housing portion of said frame member said semiconductor element having a plurality of electrodes;
• (c) after said step (b), electrically connecting by a fine wire between at least one of said plural electrodes of said semiconductor element and a top surface of at least one of said projecting stepped portions of said plural electrode constituent portions;
• (d) encapsulating, by a resin, a surface of said frame member on the side where said semiconductor element has been fixed to said element housing portion and has been electrically connected by said fine wire;
• (e) after said step (d), grinding said frame major portion of said frame member such that said plural electrode constituent portions are separated from each other to become individual external electrodes, and exposing both a bottom surface of each of said plural external electrodes and a bottom surface of said semiconductor element from said resin;
• and
• (f) after said step (d), grinding a top surface of said resin on the side where said semiconductor element has been fixed to said element housing portion and has been electrically connected by said fine wire such that top surfaces of said projected portions are exposed from said resin top surface.

A semiconductor device comprising:

• a semiconductor element having a plurality of electrodes;
• a plurality of external electrodes disposed around the periphery of said semiconductor element, each of said plural external electrodes having at its top surface a projecting stepped portion and a projected portion and in its bottom surface a recessed portion;
• a fine wire electrically connected between a surface of at least one of said projecting stepped portions of said plural external electrodes and at least one of said plural electrodes of said semiconductor element;
• and
• an encapsulating resin which encapsulates said semiconductor element, said plural external electrodes, and said fine wire and whose external shape is a rectangular parallelepiped;
• wherein both a bottom surface of said semiconductor element and a bottom surface of each of said plural external electrodes are exposed from a bottom surface of said encapsulating resin;
• wherein a top surface of said semiconductor element and a top surface of each of said projecting stepped portions of said plural external electrodes are located substantially coplanar with each other;
• and
• wherein each of said projected portions of said plural external electrodes is exposed from a top surface of said encapsulating resin.

A method for the fabrication of a semiconductor device comprising the steps of:

• (a) preparing a frame member;
• said frame member including:
• a plate-like frame major portion having a top surface and a bottom surface;
• a plurality of electrode constituent portions which are projections formed on said top surface of said frame major portion, each of said plural electrode constituent portions having at its top surface a projecting stepped portion and a projected portion and in its bottom surface a recessed portion;
• and
• an element housing portion located in a top surface area of said frame major portion surrounded by said plural electrode constituent portions, said element housing portion housing therein a semiconductor element to be fixed thereto;
• (b) fixing said semiconductor element having a plurality of electrodes to said element housing portion of said frame member;
• (c) after said step (b), electrically connecting by a fine wire between at least one of said plural electrodes of said semiconductor element and a top surface of at least one of said projecting stepped portions of said plural electrode constituent portions;
• (d) encapsulating, by a resin, a surface of said frame member on the side where said semiconductor element has been fixed to said element housing portion and has been electrically connected by said fine wire such that at least a top surface of each of said projected portions of said plural electrode constituent portions projects;
• and
• (e) after said step (d), grinding said frame major portion of said frame member such that said plural electrode constituent portions are separated from each other to become individual external electrodes each having at its bottom surface said recessed portion, and exposing both a bottom surface of each of said plural external electrodes and a bottom surface of said semiconductor element from said resin.