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US 2001/0040283 A1Published application
Resin molding die and production method for semiconductor devices using the same
AssigneeSharp Kabushiki Kaisha
InventorsMasahiro Konishi, Hiroki Orita, Toshiyuki Takada
Life of this patent
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Abstract
A resin molding die includes: a cavity; a resin inlet through which a liquid resin to be cured is injected into the cavity; and an air vent through which air is released to an exterior space of the resin molding die during injection of the resin, the air vent being provided on an opposite side from the resin inlet with respect to the cavity.
Claims13
A resin molding die comprising:
- a cavity;
- a resin inlet through which a liquid resin to be cured is injected into the cavity;
- and
- an air vent through which air is released to an exterior space of the resin molding die during injection of the resin, the air vent being provided on an opposite side from the resin inlet with respect to the cavity.
1 more element
A method for producing a semiconductor device comprising the steps of:
- setting a semiconductor device in a cavity of a resin molding die;
- injecting a thermosetting resin from a resin injection nozzle into the cavity, through a resin inlet of the resin molding die and a gate, at a pressure which is equal to or greater than a pressure imposed by the weight of the thermosetting resin and which is equal to or less than about 2 kg/cm2;
- and
- curing the thermosetting resin to encapsulate the semiconductor device within the thermosetting resin.
1 more element
Dependencies are inferred from the claim text.