BEOL decoupling capacitor
OwnerPeter Richard Duncombe, Daniel Charles Edelstein +5inventors
InventorsPeter Richard Duncombe, Daniel Charles Edelstein, Robert Benjamin Laibowitz, Deborah Ann Neumayer, Tak Hung Ning, Robert Rosenberg, Thomas McCarroll Shaw
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Abstract
An IC including a resistor which is coupled to a metal wiring level through metal contacts, said resistor including a discrete metal-insulator-metal stack, wherein said metal contacts are in contact to one of said metals of said film stack. In the above IC design, current flows laterally through either the top metal electrode, the bottom metal electrode, or both, and any unused electrode is disconnected from the circuit.
Claims22
An integrated circuit (IC) comprising at least a resistor which is coupled to a metal wiring level of an interconnect or damascene structure through metal contacts, said resistor including a discrete metal-insulator-metal film stack, wherein said metal contacts are in contact with one of said metals of said film stack.
A method for forming an integrated circuit (IC) including at least a resistor comprising the steps of:
- (a) providing a metal-insulator-metal film stack on at least a material layer of an interconnect structure;
- (b) patterning said metal-insulator-metal film stack into discrete metal-insulator-metal film stacks;
- (c) forming metal contacts on at least one of said discrete metal-insulator-metal film stacks;
- and
- (d) forming a wiring region connected to said metal contacts.
A method for forming an integrated circuit (IC) including at least a resistor comprising the steps of:
- (a) forming metal contacts on a surface of a metal wiring region, said metal wiring region is part of an interconnect or damascene structure;
- and
- (b) forming a discrete metal-insulator-metal film stack on at least said metal contacts.
Dependencies are inferred from the claim text.