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US 2001/0040239 A1Published application
Chip-type semiconductor light-emitting device
AssigneeRohm Co., Ltd.
InventorShinji Isokawa
Life of this patent
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Abstract
A chip-type semiconductor light-emitting device includes a semiconductor light-emitting chip connected to a pair of electrodes formed on a substrate. The semiconductor light-emitting chip is molded, together with respective parts of the electrodes, by resin. The electrode has a layered structure having a Cu layer, an Ni layer and an Au layer in the order of from the lowermost layer, to have a step formed inside the mold by changing the wall thickness of the Cu layer.
Claims3
A chip-type semiconductor light-emitting device, comprising:
- a substrate;
- a pair of electrodes formed on said substrate;
- a semiconductor light-emitting chip electrically connected to said pair of electrodes;
- a mold encapsulating respective parts of said semiconductor light-emitting chip and said pair of electrodes;
- and
- a step formed in said electrodes at an inside of said mold and having a height increasing from an outer side to an inner side thereof.
3 more elements
Dependencies are inferred from the claim text.