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US 2001/0040047 A1Published application
Process for reducing extraneous metal plating
AssigneeInternational Business Machines Corporation
InventorsJohn Joseph Konrad, Konstantinos I. Papathomas, Timothy Leroy Wells, James Warren Wilson
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Abstract
Printed circuit boards, cards and chip carriers are fabricated by treating an already circuitized substrate with a swelling agent, then treating the circuitized substrate with a composition containing an alkaline permanganate, a chromate and/or chlorite and then applying a metal layer to coat the circuitized portion of the substrate.
Claims20
A method for fabricating a printed circuit board, printed circuit card or chip carrier which comprises:
- providing a circuitized substrate;
- treating said circuitized substrate with a swelling agent;
- treating said circuitized substrate with a composition comprising at least one member selected from the group consisting of alkaline permanganate, chromate, and chlorite;
- and
- applying a metal layer on said treated circuitized substrate to coat the circuitized portion of said substrate.
2 more elements
Dependencies are inferred from the claim text.