Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
OwnerSalman Akram, Derek J. Gochnour +2inventors
InventorsSalman Akram, Derek J. Gochnour, Michael E. Hess, David R. Hembree
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Abstract
A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.
Claims20
A method for forming individual electronic devices with conductive traces, comprising:
- providing a substrate comprising a plurality of columns of electronic components, each adjacent pair of columns of said plurality of columns being separated from one another by a street located therebetween;
- forming groups of conductive traces on a surface of said substrate, at least two groups of said groups of conductive traces extending at least partially over adjacent electronic components, said at least two groups of conductive traces being connected to one another and extending at least partially over said street between said adjacent semiconductor device components;
- substantially concurrently severing said at least two groups of conductive traces from one another;
- and
- severing said adjacent electronic device components along said street.
A method for forming electronic components with conductive traces, comprising:
- providing a substrate comprising a plurality of columns, each column of said plurality of columns including at least one electronic component, adjacent columns of said plurality of columns being separated from one another by a street;
- positioning groups of conductive traces on a surface of said substrate, at least two groups of said groups of conductive traces extending at least partially over different, adjacent electronic components, said at least two groups of conductive traces being connected to one another and extending at least partially over said street between said adjacent electronic components;
- severing said at least two groups of conductive traces from one another;
- and
- severing said adjacent electronic components along said street.
A method for forming at least one semiconductor device component with conductive traces, comprising:
- providing a substrate comprising a plurality of columns, each column of said plurality of columns including at least one electronic component, adjacent columns of said plurality of columns being separated from one another by a street;
- positioning groups of conductive traces on a surface of said substrate, at least one group of said groups of conductive traces extending at least partially over the at least one semiconductor device component, at least another group of said groups of conductive traces extending at least partially over an electronic component adjacent to the at least one semiconductor device component, said at one group and said at least another group being connected to one another and extending at least partially over said street between said adjacent electronic components;
- severing said at least two groups of conductive traces from one another;
- and
- severing the at least one semiconductor device component and said electronic component adjacent thereto along said street.
Dependencies are inferred from the claim text.