Apparatus for manufacturing a wiring board and method for manufacturing a wiring board
AssigneeKabushiki Kaisha Toshiba
InventorsKenji Sasaoka, Fumitoshi Ikegaya, Takahiro Mori, Tomohisa Motomura, Yoshizumi Sato, Koichiro Shibayama
Life of this patent
Estimating the term…
Abstract
The apparatus for manufacturing a wiring substitute comprises a transporter having a circuit where a sheet is circulated; a screen printer for printing a conductive paste on the sheet; a counter for counting the number of times to print the conductive paste on the sheet; and a distributor for ejecting the sheet from the circuit when the counted number reaches a preset number. Thus, the conductive pillars having uniform properties can be formed automatically on the conductive foil with high productivity.
Claims26
An apparatus for manufacturing a wiring substrate, comprising:
- a transporting means for transporting at least a sheet, and the transporting means having a circuit where the sheet is circularly transported;
- a printing means for printing a conductive paste on the sheet, and the printing means is formed on the circuit;
- a counting means for counting a number of times the conductive paste printed to the sheet;
- and
- an ejecting means for ejecting the sheet from the circuit when the counted number reaches a preset number.
An apparatus for manufacturing a wiring substrate, comprising:
- a loading means for loading at least a sheet;
- means for forming a conducive pillar to the sheet;
- and
- a second drying means for drying the conductive pillar formed on the sheet;
- wherein the means for forming a conducive pillar comprises,
- a transporting means for transporting the sheet, the transporting means having a first circuit and a second circuit where the sheet is circularly transported, and the first circuit and the second circuit having a common part,
- a first printing means for printing a conductive paste on the sheet, and the first printing means is formed on the first circuit,
- a second printing means for printing the conductive paste on the sheet, and the second printing means is formed on the second circuit,
- a counting means for counting a number of times the conductive paste printed to the sheet,
- a first drying means for drying the conductive paste printed on the sheet, and the first drying means formed on the common part of the first circuit and the second circuit,
- a first distributing means for distributes the sheet loaded from the loading means to the first circuit and the second circuit, and the first distributing means distributes the sheet ejected from the first drying means to the first circuit and the second circuit, and
- a second distributing means for distributes the sheet ejected from the first printing means and the sheet ejected from the second printing means to the first drying means when the counted number is less than a preset number, and the second distributing means distributes the sheet ejected from the first printing means and the sheet ejected from the second printing means to the second drying means when the counted number reaches the preset number.
An apparatus for manufacturing a wiring substrate, comprising:
- a pair of rolls having a substantially parallel rotating axis, and the rolls are held so as to form a gap;
- means for loading a conductive sheet having a first face where conductive pillars are formed, an insulating sheet, and a releasing sheet to the gap between the rolls so that the insulating resin sheet is interposed between the first face of the conductive sheet and the releasing sheet;
- and
- an adjusting means for adjusting the gap between the rolls so that the conductive pillars pierce the insulating resin sheet.
A method for manufacturing a wiring substrate, comprising steps of:
- loading a conductive sheet having a first face where conductive pillars are formed, an insulating sheet, and a releasing sheet to a gap of a pair of rolls having a substantially parallel rotating axis so that the insulating resin sheet is interposed between the first face of the conductive sheet and the releasing sheet;
- and
- adjusting the gap between the rolls so that the conductive pillars pierce the insulating resin sheet.
An apparatus for manufacturing a wiring substrate, comprising:
- a holding means having a planer surface for holding an insulating resin sheet having a first face and a second face, the holding means aspirates the first face of the insulating resin sheet on the plane surface;
- a housing for storing a conductive foil, the housing having an opening for introducing the holding means holding the insulating resin sheet;
- a transporting means for transporting the holding means into the housing through the opening, the transporting means piling the insulating resin sheet onto the conductive foil;
- and
- an adjusting means for adjusting a pressure inside the housing so that the pressure inside the housing is higher than a pressure outside the housing.
Dependencies are inferred from the claim text.