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US 2001/0036804 A1Published application
CMP polishing pad including a solid catalyst
AssigneeCabot Microelectronics Corporation
InventorsBrian L. Mueller, Shumin Wang
Life of this patent
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Abstract
A polishing pad comprising a polishing pad substrate and at least one solid catalyst, the polishing pad being useful to remove metal layers from a substrate.
Claims44
A polishing pad including;
- a polishing pad substrate;
- and
- at least heterogeneous solid catalyst.
A polishing pad including;
- a polishing pad substrate;
- and
- from about 0.005 to about 20.0 wt % of a photoactivated non-metallic solid catalyst selected from the group consisting of TiO2, Ti2O3, and mixtures thereof.
A method for polishing a substrate surface including at least one metal portion comprising the steps of:
- (a) preparing a polishing pad by incorporating at least one non-metallic solid catalyst into a polishing pad substrate;
- (b) applying a solution including an oxidizing agent to the polishing pad, to the substrate surface or both;
- (c) bringing the polishing pad into contact with the substrate surface;
- and
- (d) removing at least a portion of the metal portion from the substrate surface by moving the polishing pad in relation to the substrate.
2 more elements
Dependencies are inferred from the claim text.