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US 2001/0036798 A1Published application
Methods for chemical-mechanical polishing of semiconductor wafers
AssigneeRodel Holdings, Inc.
InventorMichael R. Oliver
Life of this patent
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Abstract
Method for polishing the surface of a semiconductor wafer is provided in which the polishing pad has on its surface a multiplicity of abrasive particles which contact the wafer surface in combination with a reactive liquid solution essentially free of abrasive particles wherein the ionic strength of the solution is changed to effect a change in polishing.
Claims6
A method of polishing a surface of a semiconductor wafer comprising the steps of:
- (a) providing a polishing pad having a polishing surface comprising a multiplicity of one type of abrasive particle in said polishing surface;
- (b) holding said wafer in a carrier such that said wafer surface is in contact with said polishing surface;
- (c) moving said carrier and/or said polishing surface to provide both pressure on said wafer surface and relative lateral motion between said wafer surface and said polishing surface;
- and
- (d) providing a reactive liquid solution essentially free from particulate matter at an interface between said wafer surface and said polishing surface, wherein a change in polishing conditions is effected by changing the ionic strength of said reactive liquid solution.
2 more elements
Dependencies are inferred from the claim text.