Polishing fluid, polishing method, semiconductor device and semiconductor device fabrication method
AssigneeLucent Technologies Inc.
InventorsSailesh Mansinh Merchant, Sudhanshu Misra, Pradip Kumar Roy, Hem M. Vaidya
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Abstract
A polishing fluid comprising a distributed organic phase and a continuous aqueous phase. The distributed phase has at least one complexing agent and the aqueous phase has abrasive particles dispersed therein. Reaction products generated during polishing interact with the complexing agent(s) to form organometallic complexes. Further disclosed is a polishing method, a semiconductor device and semiconductor device fabrication method utilizing the polishing fluid.
Claims36
A polishing fluid comprising a distributed organic phase and a continuous aqueous phase, the distributed phase having at least one complexing agent, and the aqueous phase having abrasive particles dispersed therein, wherein reaction products generated during polishing interact with the complexing agent(s) to form organometallic complexes.
A method for polishing a workpiece comprising:
- introducing a polishing fluid between the workpiece and a polishing implement;
- and
- effectively moving the polishing implement and the workpiece relative to one another;
- wherein the polishing fluid comprises:
- a distributed organic phase and a continuous aqueous phase;
- the distributed phase having at least one complexing agent;
- and
- the aqueous phase having abrasive particles dispersed therein, wherein reaction products generated during polishing interact with the complexing agent(s) to form organometallic complexes.
A method for fabricating a semiconductor device, the semiconductor device comprising one or more layers, the layer(s) having an integrated circuit disposed therein, wherein the method comprises polishing a surface of at least one of the layers by:
- introducing a polishing fluid between the surface and a polishing article;
- and
- effectively moving the device surface and the polishing article with respect to one another,
- wherein the polishing fluid comprises a distributed organic phase and a continuous aqueous phase, the distributed phase having at least one complexing agent, and the aqueous phase having abrasive particles dispersed therein, wherein reaction products generated during polishing interact with the complexing agent(s) to form organometallic complexes.
A semiconductor device comprising one or more layers, the layer(s) having an integrated circuit disposed therein, wherein a surface of at least one of the layers is polished by:
- introducing a polishing fluid between the surface and a polishing article;
- and
- effectively moving the device surface and the polishing article with respect to one another,
- wherein the polishing fluid comprises a distributed organic phase and a continuous aqueous phase, the distributed phase having at least one complexing agent, and the aqueous phase having abrasive particles dispersed therein, wherein reaction products generated during polishing interact with the complexing agent(s) to form organometallic complexes.
Dependencies are inferred from the claim text.