Methods of producing and polishing semiconductor device and polishing apparatus

A polishing method for polishing an object having a copper film on the surface to be polished, comprising the steps of:

• interposing an electrolytic solution including a chelating agent between a cathode member and the polished surface,
• applying a voltage between the cathode member functioning as a cathode and the polished surface functioning as an anode to oxidize the surface of the copper film and form a chelate film of an oxidized copper film,
• selectively removing a projecting portion of the chelate film corresponding to the shape of the copper film to expose the copper film of the projecting portion at its surface, and
• repeating the above chelate film forming step and the chelate film removing step until the projecting portion of the copper film is flattened.

A method for production of a semiconductor device, comprising the steps of:

• forming at least a groove or hole in an insulation film formed on a substrate,
• stacking a metal film on said insulation film so as to bury the groove or hole,
• interposing an electrolytic solution between a electrode member and the metal film,
• applying a predetermined voltage between the electrode member and the metal film,
• removing the surface of the metal film, and
• repeating the above step of removing the metal film until the unevenness of the surface of the metal film is reduced.

A polishing apparatus for polishing an object having a copper film on the surface to be polished, comprising:

• a polishing tool having a polishing surface and having conductivity,
• a polishing tool rotating and holding means for rotating the polishing tool about a predetermined axis of rotation and holding the same,
• a rotating and holding means for holding a polishing object and rotating the same about a predetermined axis of rotation,
• a moving and positioning means for moving and positioning the polishing tool to a target position in a direction facing the polishing object,
• a relative moving means for making the polished surface of the polishing object and the polishing surface of the polishing tool relatively move along a predetermined plane,
• an electrolytic solution feeding means for feeding an electrolytic solution comprising a chelating agent onto the polished surface, and
• a current supplying means for supplying an electrolytic current flowing through the polishing tool through the electrolytic solution from the polished surface by using the polished surface and the polishing tool.

A polishing apparatus for polishing an object having a copper film on the surface to be polished, comprising:

• a holding means for holding the polished object;
• an electrode plate arranged parallel with the polished surface;
• a vibration applying means for applying vibration on the polished object;
• an electrolytic solution feeding means for feeding an electrolytic solution including a chelating agent between the polished surface and the electrode plate;
• and
• an electrolytic current supplying means for supplying an electrolytic current flowing through said electrolytic solution from said polished surface to the electrode plate.

A polishing apparatus for polishing an object having a copper film on the surface to be polished, comprising:

• a holding means for holding the polished object;
• an electrode plate arranged parallel with the polished surface;
• an electrolytic solution feeding means for feeding an electrolytic solution including a chelating agent between the polished surface and the electrode plate;
• an electrolytic current supplying means for supplying an electrolytic current flowing through said electrolytic solution from said polished surface to the electrode plate;
• and
• a flushing means for flushing the electrolytic solution between the polished surface and the electrode plate.

A polishing apparatus for polishing an object having a metal film on the surface to be polished, comprising:

• a holding means for holding the polished object;
• a wiper for wiping the surface of the polished object;
• an electrolytic solution feeding means for feeding an electrolytic solution on the surface of the polished object;
• a facing electrode arranged at a position facing the surface of the polished object;
• and
• a current supplying means for supplying a current between the surface of the polished object and the facing electrode.

A polishing apparatus for polishing an object having a metal film on the surface to be polished, comprising:

• a holding means for holding the polished object;
• a wiper for wiping the surface of the polished object;
• a relative moving means for relatively moving the surface of the polishing object and the wiper;
• an electrolytic solution feeding means for feeding an electrolytic solution on the surface of the polished object;
• a facing electrode arranged at a position facing the surface of the polished object;
• and
• a current supplying means for supplying a current between the surface of the polished object and the facing electrode.