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US 2001/0036721 A1Published application
Process for metallizing at least one insulating layer of a component
OwnerClaus Dallner, Klaus Lowack +2inventors
InventorsClaus Dallner, Klaus Lowack, Gunter Schmid, Recai Sezi
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Abstract
The invention relates to a process for metallizing at least one insulating layer of a component. A plurality of levels are exposed for metallization by patterning and forming connections between the insulating layers.
Claims10
A process for metallizing at least one insulating layer of an electronic or microelectronic component, which comprises:
- applying at least a first insulating layer to a substrate;
- applying at least a second insulating layer to at least the first insulating layer;
- patterning at least the second insulating layer;
- selectively activating an exposed and activatable surface to obtain exposed activated regions;
- nucleating and metallizing the exposed, activated regions.
2 more elements
Dependencies are inferred from the claim text.