Semiconductor component and method for manufacturing it

A method for manufacturing a semiconductor component, which comprises:

• applying a wiring foil to a main side of a semiconductor chip;
• producing at least one wire connection between at least one contact pad and at least one conductor track end;
• applying a sealing compound to locations on the at least one recess to completely cover the wire connection with the sealing compound;
• and
• curing only the surface of the sealing compound.

A method for manufacturing a semiconductor component, which comprises:

• placing at least one contact pad on a main side of a semiconductor chip;
• applying a wiring foil to the main side, the wiring foil having at least one conductor track on a side facing away from the main side, the at least one conductor track having conductor track ends;
• accommodating the at least one contact pad in at least one recess of the wiring foil;
• producing at least one wire connection between the at least one contact pad and at least one of the conductor track ends to electrically connect the at least one contact pad to at least one conductor track end and to connect the at least one contact pad to at least one solder contact through the at least one conductor track;
• applying a sealing compound to locations on the at least one recess to completely cover the at least one wire connection with the sealing compound, the sealing compound having a first layer and a second layer;
• and
• curing only the surface of the sealing compound.