Semiconductor device and method of manufacturing the same
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorShigenobu Maeda
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AssigneeMitsubishi Denki Kabushiki Kaisha
InventorShigenobu Maeda
Estimating the term…
A semiconductor device comprises a silicon region (1) of the first conductivity type, a porous silicon layer (2) formed inside the silicon region (1) as a buried layer and a source region (3a) and a drain region (4a) of the second conductivity type different from the first conductivity type selectively formed in an upper surface of the silicon region (1). Bottom surfaces of the source region (3a) and the drain region (4a) are located adjacently above an upper surface of the porous silicon layer (2). As a result, depletion layers (8) in pn junctions between the silicon region (1) and the bottom surfaces of the source region (3a) and the drain region (4a) reach the inside of the porous silicon layer (2). With this structure, a semiconductor device which achieves a faster operation and lower power consumption while ensuring stability in operation of a MOSFET and a method of manufacturing the same are provided.
A semiconductor device, comprising:
A semiconductor device, comprising:
A method of manufacturing a semiconductor device, comprising the steps of:
Dependencies are inferred from the claim text.