Manufacturing method for semiconductor device
AssigneeSeiko Epson Corporation
InventorMichiyoshi Takano
Life of this patent
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Abstract
A semiconductor device and a manufacturing method thereof are provided, wherein both bumps of a semiconductor chip and leads on a tape substrate can be accurately connected at the time of performing thermocompression bonding of the two using a heating tool. The film tape carrier and semiconductor chip expand due to heat applied from the heating tool of the gang bonding apparatus, so setting the pitch of the bumps and the pitch of the inner leads, taking into consideration beforehand the difference in linear expansion coefficient of the two at the time of gang bonding, solves the problem.
Claims7
A manufacturing method for a semiconductor device wherein a semiconductor chip is mounted on a tape substrate, said method comprising:
- a step for causing leads formed on said tape substrate and bumps formed on an active face of said semiconductor chip to face one another;
- and
- a step for lowering a heating tool and bringing the heating tool into contact with said leads, and performing thermocompression bonding of said leads and said bumps,
- a lowering speed of said heating tool being changed up to coming into contact with said leads.
A semiconductor device manufacturing method for bonding a tape substrate upon which leads are formed and a semiconductor chip upon which bumps are formed on an active face thereof, said method comprising at least:
- a step for preparing said tape substrate such that a pitch width of said leads has been set beforehand so as to be equal to a value obtained by multiplying a pitch of said bumps by a ratio of a linear expansion coefficient of said semiconductor chip as to a linear expansion coefficient of said tape substrate at a heating temperature of thermocompression bonding of said bumps and said leads;
- a step for positioning at least one reference bump of said bumps and a reference lead to correspond to said reference bump such that center lines of said reference bump and said reference lead overlap, and also for positioning each of said leads so as to respectively face said bumps;
- and
- a step for lowering a heating tool from above said leads and bringing the heating tool into contact with said leads, and performing thermocompression bonding of said leads and said bumps.
A semiconductor device manufacturing method for bonding a tape substrate upon which leads are formed and a semiconductor chip upon which bumps are formed on an active face thereof, said method comprising:
- a step for preparing said tape substrate such that a pitch width of said leads has been set beforehand so as to be equal to a value obtained by multiplying a pitch of said bumps by a ratio of said linear expansion coefficient of said semiconductor chip as to a linear expansion coefficient of said tape substrate at a heating temperature of thermocompression bonding of said bumps and said leads;
- a step for positioning at least one reference bump of said bumps and a reference lead to correspond to said reference bump such that center lines of said reference bump and said reference lead overlap, and also for positioning each of said leads so as to respectively face said bumps;
- and
- a step for lowering a heating tool from above said leads and bringing the heating tool into contact with said leads, and performing thermocompression bonding of said leads and said bumps,
- a lowering speed of said heating tool changing as said leads are approached.
Dependencies are inferred from the claim text.