Electronic component and manufacturing method therefor

A method of manufacturing an electronic component having a construction in which surface-mounting components are accommodated inside a shielding case, the method comprising the steps of:

• preparing a mother printed-circuit board on which a plurality of surface-mounting components are to be mounted, the mother printed-circuit board provided with component-connecting electrodes to which external electrodes of the surface-mounting components are to be connected, engagement holes into which engagement protrusion portions of a shielding case are to be inserted, and case-fixing electrodes provided inside the engagement holes;
• mounting a first portion of a predetermined number of surface-mounting components on the mother printed-circuit board and connecting external electrodes of the surface-mounting components to the component-connecting electrodes of the mother printed-circuit board;
• applying soldering paste to component-connecting electrodes on which surface-mounting components are not yet mounted, and applying soldering paste in at least one of a vicinity of the engagement holes and in an area covering at least a portion of the engagement hole and the vicinity of the engagement holes on the mother printed-circuit board, from the side of the component-mounted surface on which the surface-mounting components have been mounted, such that soldering paste is not entirely filled inside the engagement hole;
• placing a second portion of the surface-mounting components which are not yet mounted on the mother printed-circuit board such that the external electrodes of the surface-mounting components are opposed to the soldering paste applied on the component-connecting electrodes;
• engaging a plurality of shielding cases with the mother printed-circuit board such that the engagement protrusion portions of the shielding case are inserted into the engagement holes of the mother printed-circuit board;
• soldering the external electrodes of the second portion of surface-mounting components put on the mother printed-circuit board subsequent to the first portion to the component-connecting electrodes, and soldering the engagement protrusion portions of the shielding cases to case-fixing electrodes inside the engagement holes by melting the soldering paste;
• and
• cutting the mother printed-circuit board into areas on each of which a shielding case is mounted, and dividing the mother printed-circuit board into a plurality of individual electronic components in each of which surface-mounting components are accommodated inside a shielding case.