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US 2001/0036677 A1Published application
Semiconductor wafer having identification indication and method of manufacturing the same
AssigneeKabushiki Kaisha Toshiba
InventorsHiroyuki Yano, Katsuya Okumura
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Abstract
An identification indication is formed on a side surface of a semiconductor wafer, and thus even if various treatment processes are repeatedly conducted for forming a semiconductor circuit, or even by the wrapping treatment on the rear side of the wafer, the identification indication cannot disappear or become unclear so that the identification indication can be clearly recognized at least until the process for cutting the wafer into chips.
Claims9
A method of manufacturing a semiconductor device comprising the steps of:
- forming a semiconductor wafer identification indication on a selected side surface portion to remain after a semiconductor wafer abrading treatment from a rear surface for having the semiconductor wafer thinner,
- forming a semiconductor circuit on a chip area portion of the semiconductor wafer,
- examining whether a defect is generated after each treatment step as well as recognizing the identification indication of the semiconductor wafer for identifying the semiconductor wafer where a defect is generated, and
- cutting and separating the semiconductor wafer into semiconductor chips after forming the semiconductor circuit on the chip area portion of the semiconductor wafer.
1 more element
Dependencies are inferred from the claim text.