Apparatus for automated preparation of DNA samples and reactor for rpeparing DNA samples
AssigneeHitachi Electronics Engineering Co., Ltd.
InventorsRyoji Memoto, Hidemi Yoshida, Hisashi Hagiwara
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AssigneeHitachi Electronics Engineering Co., Ltd.
InventorsRyoji Memoto, Hidemi Yoshida, Hisashi Hagiwara
Estimating the term…
An apparatus for automated preparation of DNA samples which comprises a reactor for preparing DNA samples and adjacent thereto an enzyme supply section, a plate holding section, a nozzle sealing section and a cleaning tank section, and wherein plates are loaded onto or unloaded from said plate holding section by means of a transport robot. The reactor for preparing DNA samples comprises a plurality of hollow electroconductive nozzles, hollow syringes coupled to said nozzles and pistons inserted into said syringes, the top of each of said pistons having a piston head secured thereto such that it can move up and down independently of said reactor for preparing DNA samples, the intermediate portions of said electroconductive nozzles being encased in a housing having an opening on both sides, a cooling mechanism being provided adjacent one of said openings, and electroconductive boards being connected to the intermediate portions of the electroconductive nozzles within said housing and also connected to a power supply via conductors.
An apparatus for automated preparation of DNA samples which comprises a reactor for preparing DNA samples and adjacent thereto an enzyme supply section, a plate holding section, a nozzle sealing section and a cleaning tank section, and wherein plates are loaded onto or unloaded from said plate holding section by means of a transport robot.
A reactor for preparing DNA samples which comprises a plurality of hollow electroconductive nozzles, hollow syringes coupled to said nozzles and pistons inserted into said syringes, the top of each of said pistons having a piston head secured thereto such that it can move up and down independently of said reactor for preparing DNA samples, the intermediate portions of said electroconductive nozzles being encased in a housing having an opening on both sides, a cooling mechanism being provided adjacent one of said openings, and electroconductive boards being connected to the intermediate portions of the electroconductive nozzles within said housing and also connected to a power supply via conductors.
Dependencies are inferred from the claim text.