US 2001/0036337 A1 · Optical module

Abstract

In a mounting structure of an optical module, an optical semiconductor device such as a light emitting device or a photo sensing device and an optical fiber are mounted. The optical fiber is directly mounted in a mounting groove formed on a top face of the substrate. The optical semiconductor device is mounted on a front face of a carrier corresponding to {110} surface or {100} surface equivalent to (110) surface or (100) surface of a single crystalline silicon. The carrier has a slanted first positioning face corresponding to {111} surface equivalent to (111) surface of the single crystalline silicon. The substrate has a slanted second positioning face corresponding to {111} surface equivalent to (111) surface of the single crystalline silicon with respect to the top face corresponding to {110} surface or {100} surface of the single crystalline silicon. Thus, the front face of the carrier becomes perpendicular to the top face of the substrate.

Claims19

Dependent claims

A carrier for optical semiconductor device having a device mounting face on which at least one optical semiconductor device is to be mounted and at least one positioning face slanted by a predetermined angle with respect to the device mounting face and disposed below a position at which the optical semiconductor device is mounted.

A mounting structure of an optical semiconductor device comprising a carrier on which at least one optical semiconductor device is mounted and a substrate on which the carrier with the optical semiconductor device and another optical device are mounted, wherein

the carrier has a device mounting face on which at least one optical semiconductor device is to be mounted and at least one first positioning face slanted by a first predetermined angle with respect to the device mounting face and disposed below a position at which the optical semiconductor device is mounted;
and
the substrate has at least one second positioning face slanted by a second predetermined angle with respect to a top face of the substrate to which the positioning face of the carrier is contacted.

An optical module comprising a carrier, a substrate respectively having the above-mentioned configurations, at least one optical semiconductor device mounted on the carrier and at least one optical fiber mounted on the substrate so as to be optically coupled with the optical semiconductor device, wherein

the carrier has a device mounting face on which the optical semiconductor device is to be mounted and at least one first positioning face slanted by a first predetermined angle with respect to the device mounting face and disposed below a position at which the optical semiconductor device is mounted;
and
the substrate has at least one second positioning face slanted by a second predetermined angle with respect to a top face of the substrate to which the positioning face of the carrier is contacted and at least one positioning groove in which the optical fiber is mounted in a manner so that an end face of the optical fiber face a functional face of the optical semiconductor device.

Dependencies are inferred from the claim text.

Optical module

Life of this patent

Optical module

Life of this patent

Abstract

Claims19