Sealing material for flip-chip semiconductor device, and flip-chip semiconductor device made therewith
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsKazuaki Sumita, Toshio Shiobara
Life of this patent
Estimating the term…
Abstract
A sealing material for flip chip-type semiconductor devices comprises a liquid epoxy resin composition which includes (A) a liquid epoxy resin, (B) an optional curing agent, (C) an inorganic filler, and (D) 1 to 15 parts by weight of a microencapsulated catalyst per 100 parts by weight of components A and B combined. The excellent thin-film penetration and shelf stability of the sealing material confer a very high reliability to flip chip-type semiconductor devices made using the sealing material.
Claims6
A sealing material for flip chip-type semiconductor devices, the sealing material comprising a liquid epoxy resin composition which includes:
- (A) a liquid epoxy resin,
- (C) an inorganic filler, and
- (D) 1 to 15 parts by weight of a microencapsulated catalyst per 100 parts by weight of component A.
A sealing material for flip chip-type semiconductor devices, the sealing material comprising a liquid epoxy resin composition which includes:
- (A) a liquid epoxy resin,
- (B) a curing agent
- (C) an inorganic filler, and
- (D) 1 to 15 parts by weight of a microencapsulated catalyst per 100 parts by weight of components A and B combined.
Dependencies are inferred from the claim text.