EMI and RFI shielding for printed circuit boards

A method of EMI shielding a circuit board or flexible circuitry, the method comprising:

• encapsulating an electronic component with a conforming insulating base coating;
• applying a first conductive layer over the base coating;
• and
• grounding the conductive layer to a ground trace to form an EMI shield for the electronic component.

A flexible circuitry comprising:

• a flexible substrate;
• a ground trace and a circuit coupled to the flexible substrate;
• a conformal coating attached to the flexible substrate over the circuit;
• and
• a conductive layer disposed over the conformal coating and contacting the ground trace, wherein the grounded conductive layer forms an electromagnetic interference shield for the flexible circuitry.

A circuit board comprising:

• a substrate;
• a ground trace and at least one electronic component coupled to the substrate;
• and
• a thermoform comprising a vacuum metallized conductive layer, wherein the thermoform can be disposed over the electronic component and coupled to the ground trace.

A shielded circuit board comprising:

• a substrate comprising a ground trace;
• at least a first and second electronic component disposed on the substrate;
• and
• a substrate body comprising a vacuum metallized conductive layer, wherein the thermoform body comprises attachment surfaces that can be coupled to the ground trace;
• wherein the substrate body comprises a first and second compartment such that when the attachment surfaces are coupled to the ground trace, the first electronic component is disposed in the first compartment and the second electronic component is disposed in the second compartment.

A method of shielding electronic components on a circuit board, the method comprising:

• providing a vacuum metallized substrate comprising a plurality of compartments;
• coupling attachment surfaces of the metallized substrate to a ground trace on a circuit board with a conductive adhesive;
• and
• separating electronic components into the compartments of the metallized substrate so as to prevent cross talk between the electronic components.

An EMI shield for components of a PCB, the shield comprising:

• a substrate;
• a ground trace and at least one electronic component coupled to the substrate;
• and
• a mold injected plastic substrate comprising a vacuum metallized conductive layer, wherein the mold injected plastic substrate can be disposed over the electronic component and coupled to the ground trace.