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US 2001/0033477 A1Published application
Coolant cooled type semiconductor device
AssigneeDenso Corporation
InventorsSeiji Inoue, Yasuyuki Ohkouchi
Life of this patent
Estimating the term…
Abstract
A coolant cooled type semiconductor device capable of achieving a superior heat radiation capability is provided, while having a simple structure. While a plurality of semiconductor modules 1 are arranged in such a manner that main surface directions of these semiconductor modules 1 are positioned in parallel to each other in a interval along a thickness direction thereof. These semiconductor modules 1 are sandwiched by coolant tube 2 having folded portions with fixing members 6, 7, 10. As a consequence, both surfaces of the semiconductor module 1 can be cooled by a single coolant tube with a uniform pinching force.
Claims69
A cooled type semiconductor device comprising:
- a semiconductor device;
- first cooling member and second cooling member sandwiching the semiconductor device therebetween for cooling the semiconductor device;
- first insulating member disposed between the first cooling member and the semiconductor device;
- second insulating member disposed between the second cooling member and the semiconductor device.
1 more element
A cooled type semiconductor device comprising:
- a semiconductor device;
- and
- a coolant tube having a first flat contact surface, through which a cooling medium flows;
- wherein:
- said coolant tube has a folded portion, a first portion and a second portion connected to the first portion through the folded portion, said first portion and second portion are closely contacted to said semiconductor device so that the first flat contact surface of the coolant tube contacts both surfaces of the semiconductor device.
2 more elements
A cooled type semiconductor device comprising:
- a semiconductor device;
- and
- first and second coolant tube portions through which a cooling medium flows, each of the first and second coolant tube portions having a flat contact surface,;
- wherein:
- said semiconductor device is pinched between the first and second coolant tube portion so that the flat contact surface of each coolant tube portions contacts the semiconductor device.
2 more elements
A cooled type semiconductor device comprising:
- a semiconductor device;
- a coolant distribution tube which is closely contacted through an insulating spacer to said semiconductor device, and through which a cooling medium passes;
- and
- a case for storing therein said semiconductor device and said coolant distribution tube, wherein:
- said coolant distribution tube is fixed to said case and is projected outside said case, and said coolant distribution tube has both end portions to which distribution tubes of an external cooling mechanism are detachably coupled.
2 more elements
A cooled type semiconductor device comprising:
- a pair of headers extended in parallel with each other at a predetermined interval;
- a plurality of cooling tubes arranged at a predetermined interval, having end portions, and joined to both said headers at said end portions through connecting tube portions;
- and
- a semiconductor device pinched between said flat cooling tubes;
- wherein at least one of said cooling tube, said end portions of the cooling tube, and said connecting tube portions are deformed when pinching force is applied thereto in a thickness direction of said semiconductor device.
2 more elements
A cooled type semiconductor device comprising:
- a pair of headers extending parallel with each other at a predetermined interval and each of the headers having connecting tube portions;
- a plurality of cooling tubes arranged in parallel with one another, each of which having end portions, and joined to said both headers at said end portions through said connecting tube portions;
- and
- a semiconductor device pinched between adjacent two of said cooling tubes;
- wherein at least one of said end portions of one of said adjacent two of the cooling tubes and said connecting tube portions is greatly deformed in comparison with the cooling tubes when pinching force is applied thereto in a thickness direction of said semiconductor device.
2 more elements
A cooled type semiconductor device comprising:
- a pair of headers extending parallel with each other at a predetermined interval;
- a plurality of cooling tubes arranged at a predetermined interval and each of which having both ends joined to said both headers through connecting tube portions;
- and
- a semiconductor device pinched between adjacent two of said cooling tubes;
- wherein at least one of the end portions of one of said adjacent two of the cooling tubes is greatly deformed by pinching force applied thereto in comparison with central portion of one of said adjacent two of the cooling tubes.
2 more elements
A cooled type semiconductor device comprising:
- a pair of headers extending in parallel with each other at a predetermined interval;
- a plurality of cooling tubes arranged at a predetermined interval, each having both ends joined to said both headers through connecting tube portions;
- a semiconductor device pinched between adjacent two of said cooling tubes;
- and
- a biasing member for biasing at least one of said adjacent two of the cooling tubes to said semiconductor device, wherein:
- one of said adjacent two of the cooling tubes is greatly deformed by said biasing member in comparison with another one of said adjacent two of the cooling tubes.
3 more elements
A cooled type semiconductor switching module comprising:
- a high-sided semiconductor chip having a high-sided semiconductor switching element;
- a low-sided semiconductor chip having a low-sided semiconductor switching element, and constituting an inverter circuit with said high-sided semiconductor chip;
- and
- a high-sided plate, a middle-sided plate, and a low-sided plate, which are made of metal plates, respectively, wherein:
- main electrode surfaces of both said semiconductor chips on output sides thereof are separated from each other, and are electrically connected to an inner surface of said middle-sided plate;
- another surface of said high-sided semiconductor chip is electrically connected to an inner surface of said high-sided plate;
- another surface of said low-sided semiconductor chip is electrically connected to an inner surface of said low-sided plate;
- and
- both said semiconductor chips are covered in an integral form by a sealing resin portion, while exposing outer surfaces of said middle-sided plate, said high-sided plate, and said low-sided plate.
6 more elements
A three-phase semiconductor switching module comprising:
- three single-phase inverter circuits connected each other in a parallel manner, each of which comprising:
- a high-sided semiconductor chip having a high-sided semiconductor switching element;
- a low-sided semiconductor chip having a low-sided semiconductor switching element and being connected with said high-sided semiconductor chip;
- a high-sided plate, a low-sided plate, and middle-sided plates of a U-phase, a V-phase, and a W-phase, which are made of metal plates respectively;
- wherein main electrode surfaces of both said semiconductor chips for the U-phase on output sides thereof are electrically connected to an inner-sided main surface of said middle-sided plate for the U-phase, while said main electrode surfaces thereof are separated from each other;
- main electrode surfaces of both said semiconductor chips for the V-phase on output sides thereof are electrically connected to an inner-sided main surface of said middle-sided plate for the V-phase, while said main electrode surfaces thereof are separated from each other;
- main electrode surfaces of both said semiconductor chips for the W-phase on output sides thereof are electrically connected to an inner-sided main surface of said middle-sided plate for the W-phase, while said main electrode surfaces thereof are separated from each other;
- a main electrode surface of said high-sided semiconductor chip for each phase is electrically connected to an inner-sided main surface of said high-sided plate;
- a main electrode surface of said low-sided semiconductor chip for each phase is connected to an inner-sided main surface of said low-sided plate;
- and
- both said semiconductor chips for each phase are covered in an integral form by a sealing resin portion, while exposing outer main surfaces of said middle-sided plate for each phase, said high-sided plate for each phase, and said low-sided plate for each phase.
8 more elements
A cooled type semiconductor device comprises:
- a semiconductor module including metallic heat radiating plates and a semiconductor element chip interposed between the metallic heat radiating plates;
- a heat sink contacting one of said metallic heat radiating plates;
- and
- a biasing-holding member having a heat conducting property and pressing another one of said metallic heat radiating plates.
1 more element
Dependencies are inferred from the claim text.