Mounting structure for semiconductor device, electro-optical device, and electronic apparatus

A device comprising:

• a substrate having a mounting region;
• a group of terminals provided in said mounting region, said group of terminals including a group of spaced apart terminals;
• a semiconductor device;
• a group of electrodes provided on said semiconductor device;
• and
• an anisotropic conductive film disposed between said substrate and said semiconductor device and conductively interconnecting said group of terminals and said group of electrodes, a resin component of said anisotropic conductive film occupying the spaces between said spaced apart terminals.

A device comprising:

• a substrate having a mounting region and a connecting region;
• a group of first terminals provided in said mounting region, said group of first terminals including a group of first spaced apart terminals;
• a group of second terminals provided in said connecting region, said group of second terminals including a group of second spaced apart terminals;
• a semiconductor device including a group of first electrodes provided thereon;
• a flexible wiring board including a group of second electrodes provided thereon;
• and
• an anisotropic conductive film disposed between said substrate and said semiconductor device and between said substrate and said flexible wiring board, said anisotropic conductive film conductively interconnecting said group of first terminals and said group of first electrodes and conductively interconnecting said group of second terminals and said group of second electrodes, a resin component of said anisotropic conductive film occupying the spaces between said first spaced apart terminals and the spaces between said second spaced apart terminals.

A device comprising:

• a first substrate;
• a wiring pattern formed on the substrate, the wiring pattern including an end portion that is divided into several parts;
• a semiconductor device mounted on the substrate;
• an electrode provided on the semiconductor device such that the electrode is connected to the end portion of the wiring pattern;
• and
• an adhesive disposed between the end portion and the electrode.

A device comprising:

• a first substrate;
• a wiring pattern formed on the first substrate, the wiring pattern including first and second end portions, the second end portion being divided into several parts;
• a semiconductor device mounted on the first substrate;
• an electrode provided on the semiconductor device such that the electrode is connected to the first end portion of the wiring pattern;
• a second substrate;
• a second electrode formed on the second substrate, the second electrode being connected to the second end portion of the wiring pattern;
• and
• an adhesive disposed between the second end portion of the wiring pattern and the second electrode.

A liquid crystal device comprising:

• a first substrate;
• a second substrate opposing the first substrate, the second substrate having a protruding portion protruding relative to an edge of the first substrate;
• a wiring pattern formed on the second substrate, the wiring pattern including an end portion that is divided into several parts;
• a driving IC mounted on the first substrate;
• an electrode provided on the driving IC such that the electrode is connected to the end portion of the wiring pattern;
• and
• an adhesive disposed between the wiring pattern and the electrode.

A liquid crystal device comprising:

• a first substrate;
• a second substrate opposing the first substrate, the second substrate having a protruding portion protruding relative to an edge of the first substrate;
• a wiring pattern formed on the second substrate, the wiring pattern including first and second end portions, the second end portion being divided into several parts;
• a driving IC mounted on the second substrate;
• an electrode arranged on the driving IC such that the electrode is connected to the first end portion of the wiring pattern;
• a flexible wiring substrate;
• a second electrode formed on the flexible wiring substrate, the second electrode being connected to the second end portion of the wiring pattern;
• and
• an adhesive disposed between the second end portion of the wiring pattern and the second electrode.