Probe tip card for the testing of semiconductor components
AssigneeSTMicroelectronics S.r.l.
InventorHERVE DESHAYES
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Abstract
A probe tip card for enabling testing of components on a semiconductor wafer includes a printed circuit support card and a set of probe tips connected to the printed circuit support card. The probe tips are tilted with respect to the surface of the card and are held in a tilted position between an upper grid and a lower grid. The probe tip card allows for the testing of chips before they are diced from a semiconductor wafer.
Claims7
A probe tip card for the testing of components on a semiconductor wafer, comprising a printed circuit support card and a set of probe tips connected to said printed circuit support card, wherein the probe tips are tilted with respect to the surface of the card and held in this tilted position between an upper grid and a lower grid.
Dependencies are inferred from the claim text.