Back to results
US 2001/0033018 A1Published application
Semiconductor device, its manufacturing method and electrodeposition frame
AssigneeTorex Semiconductor Ltd.
InventorHiroshi Kimura
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes: a semiconductor element 2 bonded on a first metallic layer; a wire 4 for electrically connecting an electrode pad of the semiconductor element to a second metallic layer; and a resin package 7 for sealing said semiconductor element. Rear surfaces of the first metallic layer 8a and the second metallic layer 8b are flush with a bottom of said resin package.
Claims8
A semiconductor device comprising:
- a semiconductor element bonded on a first metallic layer;
- a wire for electrically connecting an electrode pad of the semiconductor element to a second metallic layer;
- and
- a resin package for sealing said semiconductor element,
- wherein rear surfaces of the first metallic layer and the second metallic layer are flush with a bottom of said resin package.
2 more elements
A method of manufacturing a semiconductor device comprising the steps of:
- forming an electrodeposition frame on a flexible flat metallic substrate, said electrodeposition frame with first metallic layers and second metallic layers for external extension being patterned;
- contiguously mounting a plurality of semiconductor elements each with electrode pads thereon, on said first metallic layers, respectively;
- wire-bonding the electrode pads to said second metallic layers which are located between said semiconductor elements;
- resin-sealing said semiconductor elements mounted on said electrodeposition frame;
- removing said metallic substrate to provide a resin sealing body;
- and
- cutting said resin sealing body into individual semiconductor devices with the air of cutting marks formed the first and second metallic layers.
4 more elements
Dependencies are inferred from the claim text.