Chip package and method of making and testing the same

An integrated-circuit (IC) package configured for ease of testing, comprising:

• a substrate including one or more test points and conductive contacts on an outer surface of said substrate and a first electrical circuitry, the first electrical circuitry being electrically continuous with the test points and the conductive contacts;
• a dielectric member disposed on said substrate and configured for housing an IC, said dielectric member including a second electrical circuitry, the second electrical circuitry being electrically continuous with the first electrical circuitry of said substrate through the conductive contacts of said substrate and said dielectric member so that upon connecting an IC to the substrate, the one or more test points of said substrate are in electrical communication with the IC housed by said dielectric member.

An integrated-circuit (IC) package configured for ease of testing, comprising:

• a substrate including conductive contacts on an outer surface of said substrate and a first electrical circuitry, the first electrical circuitry being electrically continuous with the conductive contacts;
• a dielectric member disposed on said substrate and configured for housing an IC, said dielectric member including one or more test points and a second electrical circuitry, the second electrical circuitry being electrically continuous with the first electrical circuitry of said substrate through the conductive contacts of said substrate and said dielectric member so that upon connecting an IC to the substrate, the one or more test points of said dielectric member are in electrical communication with the IC housed by said dielectric member.