Semiconductor device and method of manufacturing the same
OwnerMasato Sumikawa, Kazumi Tanakainventors
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Abstract
A semiconductor device is manufactured in a method including the steps of: abrasing a surface of a wafer opposite that thereof having a solder ball serving as an external connection electrode; and reinforcing the abrased surface with resin serving as a back-surface reinforcement member. More specifically, the resin is resin of rubber type, silicone type, epoxy type, polyimide type or urethane type. Preferably, previously grinding the surface to be abrased is previously ground to produce the device in a reduced process time. The structure can advantageously prevent a solder connection from breaking as an LSI chip fails to bend in response when the entire package receives force and thus bends.
Claims16
A semiconductor device including a semiconductor substrate having a surface provided with an external connection electrode and a surface opposite that with said external connection electrode, abrased and reinforced with a back-surface reinforcement member.
A method of manufacturing a semiconductor device comprising the steps of:
- abrasing a surface of a semiconductor substrate opposite to a surface thereof having an external connection electrode;
- and applying resin on said surface abrased.
Dependencies are inferred from the claim text.