High frequency, low cost package for semiconductor devices
AssigneeSophia Wireless, Inc.
InventorPhilip Joseph Koh
Life of this patent
Estimating the term…
Abstract
A direct attachment technique is described for silicon packages housing high frequency devices. A silicon package may be shaped as either a plug or a socket or the package may have both the plug and socket capability, thus enabling the package to be directly attached to other packages The plug is trapezoidal in cross section while the socket has a dovetail-joint-like aperture. The plug is inserted into the socket thereby directly attaching one package to another. The two packages are locked together when the slanted edges of the plug are fitted to the slanted edges of the socket.
Claims22
An interconnectable module usable with high frequency devices comprising:
- a first package of micromachinable material for housing an integrated circuit, said first package having at least one female connection component;
- a second package of micromachinable material for housing an integrated circuit, said second package having at least one male connection component;
- wherein the male component of the second package is configured to be able to slide into the female component of the first package thereby coupling the first package to the second package thus providing an efficient way to transmit signals for high frequency devices.
A micromachinable substrate comprising:
- a first micromachined substrate for housing an integrated circuit;
- a second micromachined substrate bonded to said first micromachined substrate wherein the second micromachine substrate has an integral connector.
An interconnectable package comprising;
- a micromachined substrate for housing an integrated circuit wherein the micromachined substrate has at least one male connection component.
An interconnectable silicon package comprising:
- a micromachined substrate for housing an integrated circuit wherein the micromachined substrate has at least one male connection component and at least one female connection component.
A method for interlocking silicon packaged circuits comprising the steps of:
- selecting a first silicon package housing an integrated circuit and having a female connection member,
- selecting a second silicon package housing an integrated circuit and having a male connection member, and
- coupling the second silicon package to the first silicon package by sliding the male member into the female member thereby creating a functional module for high frequency devices.
A package having interconnecting capabilities comprising:
- a silicon substrate shaped in a plug formation, said plug having a trapezoidal cross section wherein the edges of said trapezoidal cross section are slanted in an inward direction so that the top surface of the plug is broader than the central surface which makes contact to the socket.
- a silicon substrate shaped in a socket formation, said socket having a dovetail aperture wherein the edges of said dovetail aperture are slanted in an inward direction;
- wherein the plug is accepted by the socket thereby locking the two substrates together when the edges of the plug are fitted to the inversely slanted edges of the socket.
Dependencies are inferred from the claim text.