Wave soldering method and system used for the method
AssigneeDenso Corporation
InventorsAtaru Ichikawa, Tatsuya Kubo, Atsushi Furumoto, Kenji Arai, Mitsuhiro Sugiura, Misao Tanaka
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Abstract
In a method of soldering a work-piece in a state where the work-piece contacts a wave molten solder, a soldering process is performed while controlling an immersion depth of the work-piece into the wave molten solder to be constant. The immersion depth control is performed by changing one of a height position of the work-piece and a wave height of the wave molten solder based on a displacement amount of the work-piece in a height direction thereof. Accordingly, the soldering process can be performed with high quality even when the work-piece is thermally warped.
Claims21
A method for soldering on a reflow side of a work-piece by bringing the work-piece into contact with a wave molten solder, wherein a soldering process is performed while controlling an immersion depth of the work-piece into the wave molten solder to be constant
A wave soldering system for soldering on a work-piece by a wave molten solder, the system comprising:
- a solder bath for storing a molten solder therein;
- a wave device equipped with the solder bath for jetting the molten solder as the wave molten solder from the solder bath onto the work-piece;
- a transfer unit disposed above the solder bath for transfering the work-piece while bringing the work-piece into contact with the wave molten solder;
- a displacement detecting device for detecting a displacement amount of the work-piece in a height direction perpendicular to a work-piece surface;
- and
- an adjustment device for controlling an immersion depth of the work-piece into the wave molten solder to be constant by adjusting one of a height position of the work-piece and a wave height of the wave molten solder in the height direction.
Dependencies are inferred from the claim text.