Cutting apparatus equipped with a blade aligning means
AssigneeDisco Corporation
InventorKazuma Sekiya
Life of this patent
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Abstract
Disclosed is a cutting apparatus equipped with a means for alignment of its rotary blade relative to a selected street on a semiconductor wafer. The cutting apparatus has a marking member positioned at such a place that the rotary blade can make a mark of cutting position in an indexing direction on the marking member, thereby permitting the rotary blade to be put in precise alignment relative to a selected cutting line on the semiconductor wafer by adjusting the rotary blade in the direction traversing the street-cutting direction until the trace of the rotary blade has been put in alignment with a reference hairline.
Claims4
A cutting apparatus comprising at least a holder means for holding a workpiece to be cut and a cutting means including a rotary blade for cutting the workpiece held by the holder means, where the holder means and the cutting means are adapted to be driven relative to each other in a cutting direction, an indexing direction and a blade-thrusting direction, and further comprising a marking member positioned at such a place that the rotary blade can make a mark of cutting position in an indexing direction on the marking member in order to align the rotary blade with a cutting line on the workpiece.
Dependencies are inferred from the claim text.