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US 2001/0023830 A1Published application
Electrolytic plating method and device for a wiring board
AssigneeKabushiki Kaisha Toyoda Jidoshokki Seisakusho
InventorsToshiki Inoue, Kyoko Kumagai
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Abstract
A plating bath which accommodates an insoluble node and a printed-circuit board, and a copper dissolved bath which supplies copper ions are arranged. The insoluble anode Is arranged as opposed to the printed-circuit board being a cathode, and a forward/reverse current is applied between both of the electrodes. Iron ions are added to a plating solution.
Claims11
An electrolytic plating method, comprising:
- using a wiring board as one pole, and an insoluble electrode as the other pole;
- and
- performing electrolytic plating by applying a forward/reverse current with the use of a metal plating solution which includes iron ions by 0.1 gram/liter or more, so that microvia holes on the wiring board are filled up with metal plating.
An electrolytic plating device for a wiring board, comprising:
- an insoluble electrode which is an electrode as opposed to a wiring board;
- a metal plating solution including iron ions by 0.1 gram/liter or more;
- and
- a power source for performing electrolytic plating by applying a forward/reverse current between the wiring board and said insoluble electrode.
1 more element
Dependencies are inferred from the claim text.