# US 2001/0022484 A1 · Wire bonding method, surface acoustic wave apparatus and method for producing surface acoustic wave apparatus

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- Number: US 2001/0022484 A1
- Document ID: US20010022484A1
- Status: Published application
- Kind: A1
- Application number: 09/801,384
- Filed: 2001-03-08
- Published: 2001-09-20
- Earliest claimed: 2000-03-17
- Assignees: Murata Manufacturing Co., Ltd.
- Inventors: Norihiko Takada; Hisamitsu Kamenaga; Shingo Iwasa
- Web page: https://patentgrep.com/patent/US20010022484A1

## CPC

- H03H 3/08: for the manufacture of resonators or networks using surface acoustic waves
- B23K 20/129: {specially adapted for particular articles or work}
- H10W 72/0711: {Apparatus therefor}
- H10W 72/075: {of bond wires}
- H10W 72/07533: {Ultrasonic bonding, e.g. thermosonic bonding}
- H10W 72/50: Bond wires
- H10W 72/5522: {comprising gold [Au]}
- H10W 72/5524: {comprising aluminium [Al]}
- H10W 72/59: Bond pads specially adapted therefor
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 72/952: {comprising metals or metalloids, e.g. PbSn, Ag or Cu}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- Y10T 29/42: Piezoelectric device making
- Y10T 29/49162: by using wire as conductive path
- H03H: IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (waveguides, resonators, lines or other devices of the waveguide type H01P)
- B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A wire bonding method for ultrasonically joining two connecting electrodes with a wire includes the steps of forming at least one of the connecting electrodes with tantalum and forming the wire of one of a metallic wire having a fracture load of about 21 g or greater and a metallic wire having a fracture stress of 290 N/mm2 or greater.

## Claims

### Claim 1

A wire bonding method for ultrasonically joining two connecting electrodes with a wire, the wire bonding method comprising the steps of:
forming at least one of the connecting electrodes with tantalum; and
forming the wire from one of a metallic wire having a fracture load of about 21 g or greater and a metallic wire having a fracture stress of about 290 N/mm2 or greater.

### Claim 2 (depends on 1)

A method according to claim 1, wherein the wire is an aluminum alloy wire having the fracture load of about 21 g or greater.

### Claim 3 (depends on 1)

A method according to claim 1, wherein the wire is an Al—Si wire.

### Claim 4 (depends on 1)

A method according to claim 1, wherein the wire has fracture load of about 21 g or greater.

### Claim 5 (depends on 1)

A method according to claim 1, wherein the wire has a fracture stress of about 290 N/mm2 or greater.

### Claim 6 (depends on 1)

A method according to claim 1, wherein the wire is an aluminum alloy wire having the fracture stress of about 290 N/mm2 or greater.

### Claim 7

A surface acoustic wave apparatus comprising:
a package having an element-mounting surface, an electrode pad provided inside the package and an external connecting electrode provided outside the package and electrically connected to the electrode pad;
a surface acoustic wave element fixed on the element-mounting surface of the package, the surface acoustic wave element including a piezoelectric substrate, an interdigital transducer provided on the piezoelectric substrate and made of tantalum and a bonding electrode electrically connected to the interdigital transducer and made of tantalum; and
a bonding wire connected between the electrode pad and the bonding electrode, the bonding wire having one of a fracture stress of about 290 N/mm2 or greater and a fracture load of about 21 g or greater.

### Claim 8 (depends on 7)

A surface acoustic wave apparatus according to claim 7, wherein the bonding wire is an aluminum alloy wire.

### Claim 9 (depends on 7)

A surface acoustic wave apparatus according to claim 7, wherein the bonding wire is an Al-Si wire.

### Claim 10 (depends on 7)

A surface acoustic wave apparatus according to claim 7, wherein the bonding wire has a fracture load of 21 g or greater and a fracture stress of about 290 N/mm2.

### Claim 11 (depends on 7)

A surface acoustic wave apparatus according to claim 7, wherein the surface acoustic wave element generates a shear horizontal-type surface wave on the piezoelectric substrate.

### Claim 12

A method for producing a surface acoustic wave apparatus comprising the steps of:
fixing a surface acoustic wave element on an element-mounting surface of a package having an electrode pad provided inside the package and an external connecting electrode provided outside the package and electrically connected to the electrode pad, the surface acoustic wave element including a piezoelectric substrate, an interdigital transducer provided on the piezoelectric substrate and made of tantalum and a bonding electrode electrically connected to interdigital transducer and made of tantalum; and
electrically connecting the electrode pad and the bonding electrode via a bonding wire by disposing the bonding wire between the electrode pad and the bonding electrode, the bonding wire having one of a fracture stress of 290 N/mm2 or greater and the bonding wire and a fracture load of about 21 g or greater.

### Claim 13 (depends on 12)

The method according to claim 12, wherein the bonding wire is an aluminum alloy wire.

### Claim 14 (depends on 12)

The method according to claim 12, wherein the bonding wire is an Al—Si wire.

### Claim 15 (depends on 12)

The method according to claim 12, wherein the bonding wire has a fracture load of 21 g or greater and a fracture stress of about 290 N/mm2.

### Claim 16 (depends on 12)

A surface acoustic wave apparatus according to claim 12, wherein the surface acoustic wave element generates a shear horizontal-type surface wave on the piezoelectric substrate.