High performance cyanate-bismaleimide-epoxy resin compositions for printed circuits and encapsulants
OwnerMiguel Albert Capote, Edward S. Harrison +2inventors
InventorsMiguel Albert Capote, Edward S. Harrison, Yong-Joon Lee, Howard A. Lenos
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Abstract
A thermosetting resin system including an epoxy resin, a bismaleimide, a cyanate ester and a co-curing agent that is an aromatic moiety having unsaturated aliphatic groups and glycidyl ether groups is provided. Preferred co-curing agents are 2-allylphenyl glycidyl ether and 2,2′-diallylbisphenol A diglycidyl ether. The resin system can be employed as an encapsulant for electronic components and as dielectric layers with microvias on printed circuits.
Claims52
A curable composition that comprises:
- (a) a cyanate ester;
- (b) a bismaleimide;
- (c) a co-curing agent having the structure R1—Ar—R2 wherein Ar is at least one unsaturated aromatic carboxylic moiety, R1 is at least one unsaturated aliphatic moiety, R2 is at least one glycidyl moiety with the proviso that when two or more unsaturated aromatic carboxylic moieties are present, at least one of the unsaturated aromatic carboxylic moieties has an unsaturated aliphatic moiety and an epoxide moiety attached thereto;
- (d) an epoxy resin;
- and
- (e) optionally, a free-radical initiator.
A process of forming vias in a polymer composition comprising the steps of:
- (a) applying a layer of a resin composition that comprises
- (i) a cyanate ester;
- (ii) a bismaleimide;
- (iii) a co-curing agent having the structure R1—Ar—R2 wherein Ar is at least one unsaturated aromatic carboxylic moiety, R1 is at least one unsaturated aliphatic moiety, R2 is at least one glycidyl moiety with the proviso that when two or more unsaturated aromatic carboxylic moieties present, at least one of the unsaturated aromatic carboxylic moieties has an unsaturated aliphatic moiety and an epoxide moiety attached thereto;
- (iv) an epoxy resin;
- and
- (v) a radiation triggered free-radical initiator;
- (b) covering the layer of resin composition with a mask having windows through which radiation can be transmitted;
- (c) exposing part of the resin composition to radiation to at least partially cure the resin composition in exposed areas;
- (d) removing non-cured portions of the resin composition;
- and
- (e) completing the cure of the resin composition.
An electrical component assembly, comprising:
- (a) an electrical component having a plurality of electrical terminations;
- (b) a component carrying substrate having a plurality of electrical terminations corresponding to the terminations of the electrical component;
- and
- (c) a thermally curable adhesive composition that comprises:
- (i) a cyanate ester;
- (ii) a bismaleimide;
- (iii) a co-curing agent having the structure R1—Ar—R2 wherein Ar is at least one unsaturated aromatic carboxylic moiety, R1 is at least one unsaturated aliphatic moiety, R2 is at least one glycidyl moiety with the proviso that when two or more unsaturated aromatic carboxylic moieties are present, at least one of the unsaturated aromatic carboxylic moieties has an unsaturated aliphatic moiety and an epoxide moiety attached thereto;
- (iv) an epoxy resin;
- and
- (v) optionally, a free-radical initiator.
A process of forming vias in a polymer composition comprising the steps of:
- (a) applying a layer of a resin composition that comprises:
- (i) a cyanate ester;
- (ii) a bismaleimide;
- (iii) a co-curing agent having the structure R1—Ar—R2 wherein Ar is at least one unsaturated aromatic carboxylic moiety, R1 is at least one unsaturated aliphatic moiety, R2 is at least one glycidyl moiety with the proviso that when two or more unsaturated aromatic carboxylic moieties are present, at least one of the unsaturated aromatic carboxylic moieties has an unsaturated aliphatic moiety and an epoxide moiety attached thereto;
- (iv) an epoxy resin;
- and
- (v) optionally, a free-radical initiator;
- (b) covering the layer of resin composition with a mask having openings through which radiation can be transmitted;
- (c) exposing part of the resin composition to radiation to at least partially cure the resin composition in exposed areas;
- (d) removing non-cured portions of the resin composition;
- and
- (e) completing the cure of the resin composition.
Dependencies are inferred from the claim text.