Lead configurations
AssigneeTessera, Inc.
InventorsThomas Di Stefano, John W. Smith
Life of this patent
Estimating the term…
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AssigneeTessera, Inc.
InventorsThomas Di Stefano, John W. Smith
Estimating the term…
A microelectronic lead element includes an elongated first leg having a surface releasably attached to a substrate. The first leg has a tip end and a base end. An elongated second leg includes a surface releasably attached to a substrate, the second leg having a tip end and a base end. The base end of the first leg is arranged adjacent the base end of the second leg. A body of conductive material is adapted for electrically connecting the base ends of the first and second legs together. The first and second legs extend away from their respective base ends and said body of conductive material in a common direction. Movement of the tip ends relative to each other in a vertical direction relative to the substrate causes flexure of the first and second legs in opposite directions upon release from the substrate.
A microelectronic lead element comprising:
A microelectronic lead element comprising:
A combination of a microelectronic lead element connecting first and second microelectronic elements, said lead element comprising:
Dependencies are inferred from the claim text.