Method for producing a semiconductor component with a silicon carrier substrate
AssigneeInfineon Technologies AG
InventorFriedrich Kroner
Life of this patent
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Abstract
Semiconductor chips are mounted on a multilayer wiring of a silicon carrier substrate, while the bottom side of the carrier substrate is provided with soldering contacts in the form of solder balls and is structured in such a way that for each soldering contact a cavity, which extends through the silicon carrier substrate and is filled by the respective solder ball, is formed, so that the solder ball itself makes contact with the multilayer wiring. In this configuration, at least the side walls of the cavity are lined with an insulating material. The insulating layer is applied prior to the application of the multilayer wiring to the structured silicon carrier substrate.
Claims13
A method for producing a semiconductor component having a multichip module, the method which comprises:
- providing a silicon carrier substrate having cavities formed therein;
- applying an insulating layer at least to side walls of the cavities;
- applying a multilayer wiring to a mounting side of the silicon carrier substrate;
- and
- applying solder balls to a bottom side of the silicon carrier substrate such that the solder balls directly contact the multilayer wiring via the cavities, the solder balls providing soldering contacts for electrically connecting a multichip module to a mounting rack.
Dependencies are inferred from the claim text.