Shielded PC card packages

A peripheral device PCB package comprising:

• a first electrically conductive cover having a perimeter;
• a first electrically conductive frame attached to a portion of the perimeter of the first electrically conductive cover so as to form an electrical connection between the first electrically conductive cover and the first electrically conductive frame;
• a second electrically conductive cover having a perimeter;
• and
• a second frame attached to a portion of the perimeter of the second electrically conductive cover, wherein the first and second frames contact each other, and wherein the first and second frames contact each other, a gap exist between the first and second covers, the first frame having a portion extending towards the second cover so as to span the gap and prevent EMI/RFI transmission through the gap.

A method of assembling a peripheral device PCB package having first and second electrically conductive covers, and first and second electrically conductive frames, each of the first and second electrically conductive covers having a perimeter, the method comprising the steps of:

• injection molding a first conductive material around a portion of the perimeter of the first electrically conductive cover so as to form the first electrically conductive frame attached to the perimeter of the first electrically conductive cover, where the first electrically conductive cover is electrically connected to the first electrically conductive frame;
• injection molding a second conductive material around a portion of the perimeter of the second electrically conductive cover so as to form the second electrically conductive frame attached to the perimeter of the second electrically conductive cover, where the second electrically conductive cover is electrically connected to the second electrically conductive frame;
• and
• bonding the first electrically conductive frame to the second electrically conductive frame, where the first electrically conductive frame is electrically connected to the second electrically conductive frame, and wherein when the first frame is bonded to the second frame the first and second covers do not physically contact each other.

A method of assembling a peripheral device PCB package having first and second electrically conductive covers, and first and second electrically conductive frames made of a metallic material, each of the first and second electrically conductive covers having a perimeter, the method comprising the steps of:

• placing a metallic material into a molding machine;
• converting the metallic material to a thixotropic state;
• transferring the metallic material in the thixotropic state to a first mold where the metallic material flows around a portion of the perimeter of the first electrically conductive cover so as to form the first electrically conductive frame attached to the perimeter of the first electrically conductive cover, where the first electrically conductive cover is electrically connected to the first electrically conductive frame;
• transferring the metallic material in the thixotropic state to a second mold where the material flows around a portion of the perimeter of the second electrically conductive cover so as to form the second electrically conductive frame attached to the perimeter of the second electrically conductive cover, where the second electrically conductive cover is electrically connected to the second electrically conductive frame;
• and
• bonding the first electrically conductive frame to the second electrically conductive frame, where the first electrically conductive frame is electrically connected to the second electrically conductive frame, and wherein when the first frame is bonded to the second frame the first and second covers do not physically contact each other.

A method of forming a part having an object bonded thereto, the method comprising the steps of:

• placing a metallic material into a molding machine;
• converting the metallic material to a thixotropic state;
• inserting at least a portion of the object into a mold;
• introducing the metallic material in the thixotropic state into the mold so as to have the metallic material flow around the portion of the object in the mold;
• changing state of the metallic material in the thixotropic state to a solid state while being in the mold so as to form the part;
• and
• removing the part from the mold, the part having the object bonded thereto.

A method of forming a part having an object bonded thereto, the method comprising the steps of:

• placing a conductive material into a molding machine;
• converting the conductive material to a thixotropic state;
• inserting at least a portion of the object into a mold;
• introducing the conductive material in the thixotropic state into the mold so as to have the conductive material flow around the portion of the object in the mold;
• changing state of the conductive material in the thixotropic state to a solid state while being in the mold so as to form the part;
• and
• removing the part from the mold, the part having the object bonded thereto.