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US 2001/0019181 A1Published application
Structure of heat slug-equipped packages and the packaging method of the same
OwnerJung-Yu Lee, Chung-Hsing Tzuinventors
Life of this patent
Estimating the term…
Abstract
The package includes a chip located on a substrate with signal transferring device electrically connected between them. Solder balls connect the substrate and thus electrically connect the substrate to external circuits. Molding compound is covered to protect the chip and signal transferring means. The heat-slug is capped over the molding compound through a conductive glue. All area of the upper surface of the heat-slug is exposed to the ambient to improve the capability of spreading heat.
Claims18
A semiconductor package, comprising:
- a substrate;
- a die located and supported on said substrate with an adhesive layer between them;
- a plurality of signal transferring means electrically connected said die to said substrate;
- a sealant material attached on said substrate and said die to seal and protect said die and said plurality of signal transferring means;
- a heat-spreading device attached atop said sealant material to conduct heat from said die to ambient air;
- and
- a plurality of conductive means attached below said substrate to electrically connect a plurality of printed circuits on said substrate to external circuits.
4 more elements
A semiconductor package, comprising:
- a substrate;
- a die located and supported on said substrate with an adhesive layer between them;
- a plurality of signal transferring means which electrically connects said die to said substrate;
- a sealant material which seals and protect said die and said plurality of signal transferring means, wherein said sealant material has geometrically a concave at the top surface of the center part;
- a heat-spreading device which is attached atop said sealant material to conduct heat from said die to ambient air, wherein said head spreading device has a downward bump aligned to said concave;
- and
- a plurality of conductive means attached below said substrate to electrically connect a plurality of printed circuits on said substrate to external circuits.
4 more elements
A method for packaging a semiconductor package, comprising:
- attaching a die onto a substrate with an adhesive layer coated between them;
- electrically connecting a plurality of bond pads on said die through a plurality of signal transferring means to said substrate;
- sealing said signal transferring means and said die with a sealant material;
- priming a thermally conductive glue on said sealant material;
- attaching a heat-spreading device onto said sealant material and said thermally conductive glue;
- and
- placing conductive balls onto lower side of said substrate to electrically connect said substrate to external circuits.
4 more elements
Dependencies are inferred from the claim text.