Chip-type electronic component

A method for manufacturing a chip-type electronic component having a plurality of internal electrode films and a plurality of ceramic layers, with;

• said internal electrode films and said ceramic layers laminated alternately with each other;
• a lead-out portion of one of every two adjacent internal electrode films exposed at one of two diametrical ends in said lengthwise direction;
• a lead-out portion of the other internal electrode film of said every two adjacent internal electrode films exposed at the other of two diametrical ends in said lengthwise direction;
• and
• external electrodes being electrically connected with said lead-out portions of said internal electrode films;
• said method comprising the steps of:
• forming a ceramic laminated substrate containing a plurality of electronic component elements;
• printing a conductive paste along cutting lines on said ceramic laminated substrate corresponding to lead-out portions at which said internal electrode films are exposed, with said conductive paste printed in a strip over both sides of said cutting lines on a surface of an outermost layer;
• cutting said ceramic laminated substrate along said cutting lines to take out said electronic component elements;
• and
• pressing diametrical end surfaces of said ceramic laminated substrate at which said internal electrode films are exposed in each of said electronic component elements thus taken out against a thin film constituted of conductive paste to form a transfer film constituted of said conductive paste.

A chip-type electronic component comprising;

• a ceramic substrate having two side surfaces formed in a lengthwise direction and two side surfaces formed in a widthwise direction intersecting each other, and at least one flat surface formed in a thicknesswise direction;
• and
• at least one internal electrode film embedded in said ceramic substrate with a film surface thereof intersecting said flat surface of said ceramic substrate roughly orthogonally and a lead-out portion exposed to the outside of said ceramic substrate at said flat surface;
• with
• external electrodes constituted of said lead-out portion exposed at said flat surface.

A method for manufacturing a chip-type electronic component, comprising the steps of:

• producing a laminated substrate containing a plurality of electronic component elements by alternately laminating a plurality of internal electrode films and a plurality of dielectric green sheets;
• taking out said electronic component elements separately by cutting said laminated substrate;
• performing a baking process on each of said electronic component elements thus taken out;
• exposing lead-out portions of internal electrode films that are not electrically connected with each other in each of said electronic component elements within individual planes over distances toward two ends of a component main body parallel to said end surfaces;
• and
• forming external electrodes that are to be electrically connected with lead-out portions of said internal electrode films within the planes of an upper surface and a lower surface of each of said electronic component elements in an identical mode while maintaining distances from outer circumferential edges of each of said electronic component elements.

A method for surface mounting a chip-type electronic component on a circuit board, with said chip-type electronic component comprising;

• a ceramic substrate having two side surfaces formed in a lengthwise direction and two side surfaces formed in a widthwise direction intersecting each other, and at least one flat surface formed in a thicknesswise direction;
• and
• at least one internal electrode film embedded in said ceramic substrate with a film surface thereof intersecting said flat surface of said ceramic substrate roughly orthogonally and a lead-out portion exposed to the outside of said ceramic substrate at said flat surface;
• with
• external electrodes constituted of said lead-out portion exposed at said flat surface;
• wherein said method comprises the steps of:
• mounting said chip-type electronic component on said circuit board in a direction in which film surfaces of internal electrode films of said chip-type electronic component extend orthogonally relative to a mounting surface of said circuit board;
• and
• soldering external electrodes of said chip-type electronic component to conductive patterns formed on said circuit board.