Lead frame, circuit board with lead frame, and method for producing the lead frame
AssigneeInfineon Technologies AG
InventorsJens Pohl, Simon Muff, Eckehard Miersch
Life of this patent
Estimating the term…
Abstract
A lead frame is described which has at least one integrated electronic circuit. The integrated electronic circuit is situated in a region of a main area of the lead frame. The lead frame has at least one signal line, at least one electrically insulating plate, and an electrically conductive, grounded plate are situated. The electrically insulating plate, and the electrically conductive, grounded plate are situated, at least in sections, between the integrated electronic circuit and the signal line. A method for producing the lead frame is also described.
Claims13
A lead frame assembly, comprising:
- at least one integrated electronic circuit having a contact point;
- a lead frame having a main area and said integrated electronic circuit disposed in a region above said main area;
- a connection element disposed on said lead frame;
- at least one signal line being a path connecting said contact point to said connection element and running parallel to a plane defined by said integrated electronic circuit;
- at least one electrically insulating plate;
- and
- an electrically conductive, grounded plate disposed on said at least one electrically insulating plate, said electrically conductive, grounded plate and said at least one electrically insulating plate disposed, at least in sections, between said integrated electronic circuit and said signal line and connecting said lead frame to said integrated electronic circuit.
A circuit board, comprising:
- at least one lead frame assembly, including:
- at least one integrated electronic circuit having a contact point;
- a lead frame having a main area and said integrated electronic circuit disposed in a region above said main area;
- a connection element disposed on said lead frame;
- at least one signal line being a path connecting said contact point to said connection element and running parallel to a plane defined by said integrated electronic circuit;
- at least one electrically insulating plate;
- and
- an electrically conductive, grounded plate disposed on said at least one electrically insulating plate, said electrically conductive, grounded plate and said at least one electrically insulating plate disposed, at least in sections, between said integrated electronic circuit and said signal line and connecting said lead frame to said integrated electronic circuit.
A method for producing a lead frame assembly, which comprises the steps of:
- providing a lead frame having at least one signal line;
- providing at least one electrically insulating plate;
- disposing an electrically conductive grounded plate on the electrically insulating plate;
- and
- applying at least one integrated electronic circuit such that the electrically conductive grounded plate and the at least one electrically insulating plate are disposed, at least in sections, between the integrated electronic circuit and the signal line.
Dependencies are inferred from the claim text.