US 2001/0019170 A1 · Multichip module having a stacked chip arrangement

Abstract

A multichip module comprises at least two semiconductor chips wherein each has a row of bonding pads formed on the active surface thereof and disposed along one side edge thereof. The semiconductor chips are mounted to a substrate in a stacking arrangement wherein the upper chip is attached to the active surface of the lower chip in a manner that no portion of the upper chip interferes with a vertical line of sight of each bond pad of the lower chip to permit wire bonding thereof. Therefore, all semiconductor chips can be wire bonded simultaneously after stacking the chips on the substrate. This allows wire bonding of all chips to be completed in a single step so as to increase UPH (unit per hour), thereby reducing cost for manufacturing the MCM.

Claims10

Dependent claims

A multichip module comprising:

a substrate having a structure for making external electrical connection;
a first semiconductor chip having a first row of bonding pads formed on the active surface thereof and disposed along one side edge thereof, the first semiconductor chip being attached to the substrate;
and
a second semiconductor chip having a second row of bonding pads formed on the active surface thereof and disposed along one side edge thereof, the second semiconductor chip being attached to the active surface of the first semiconductor chip in a manner that no portion of the second semiconductor chip interferes with a vertical line of sight of each bond pad of the first row to permit wire bonding thereof,
wherein the bonding pads being electrically connected to the structure for making external electrical connection.

2 more elements

A method for producing a multichip module comprising the steps of:

providing a substrate having a structure for making external electrical connection;
attaching a first semiconductor chip onto the substrate, the first semiconductor chip having a first row of bonding pads formed on the active surface thereof and disposed along one side edge thereof;
attaching a second semiconductor chip onto the active surface of the first semiconductor chip, the second semiconductor chip having a second row of bonding pads formed on the active surface thereof and disposed along one side edge thereof, wherein no portion of the second semiconductor chip interferes with a vertical line of sight of each bond pad of the first row to permit wire bonding thereof, and
electrically coupling the bonding pads to the structure for making external electrical connection.

1 more element

Dependencies are inferred from the claim text.

Multichip module having a stacked chip arrangement

Life of this patent

Multichip module having a stacked chip arrangement

Life of this patent

Abstract

Claims10