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US 2001/0019169 A1Published application
Electronic device with double-wire bonding, manufacturing method thereof, and method for checking intactness of bonding wires of this electronic device
AssigneeSTMicroelectronics S.r.l.
InventorsFilippo Marino, Salvatore Capici
Life of this patent
Estimating the term…
Abstract
An electronic device having first and second external pins; first and second pads connected to the first external pin by respective bonding wires; and third and fourth pads connected to the second external pin respective bonding wires, and to a first common line by respective resistors. By means of a circuit configuration of this type, the intactness of the bonding wires can easily be checked by carrying out a simple resistance measurement between the first and the second external pin.
Claims25
An electronic device comprising a first and at least a second external pin;
- a first, a second and at least a third pad;
- a first bonding wire connecting said first pad to said first external pin;
- a second bonding wire connecting said second pad to said first external pin;
- a third bonding wire connecting said third pad to said second external pin;
- and a first and at least a second component having respectively a first and a second electrical impedance, and having first terminals connected respectively to said first and said second pad and second terminals connected to a first node, said first node also being connected to said third pad.
2 more elements
A method for manufacturing an electronic device, comprising:
- providing a first and at least a second external pin;
- providing a first, a second and at least a third pad;
- bonding a first bonding wire between said first pad and said first external pin, a second bonding wire between said second pad and said first external pin, and a third bonding wire between said third pad and said second external pin;
- providing a first and at least a second component having respectively a first and a second electrical impedance;
- connecting first terminals of said first and second component respectively to said first and to said second pad, and second terminals of said first and second component to a first node;
- and
- connecting said third pad to said first node.
4 more elements
A method for checking intactness of bonding wires of an electronic device having a first and at least a second external pin;
- a first, a second and at least a third pad;
- a first bonding wire connecting said first pad to said first external pin;
- a second bonding wire connecting said second pad to said first external pin;
- a third bonding wire connecting said third pad to said second external pin;
- and a first and at least a second component having respectively a first and a second electrical impedance, and having first terminals connected respectively to said first and to said second pads, and second terminals connected to a first node, said first node also being connected to said third pad;
- the method comprising carrying out at least one impedance measurement between said first and said second external pins.
3 more elements
An electronic device, comprising:
- an electrical component subdivided into at least two identical components, each identical component having first and second terminals;
- a first pin associated with each pair of the first terminals and a second pin associated with each pair of the second terminals;
- a first pair of bonding pads, each coupled to the respective first terminal of the at least two identical components and further coupled to the first pin;
- a second pair of bonding pads, each coupled to the respective second terminal of the at least two identical components and further coupled to the second pin;
- a first pair of resistive elements, each resistive element having a first terminal coupled to a respective bonding pad of the first pair of bonding pads and a second terminal coupled to the second terminal of the other resistive element;
- and
- a second pair of resistive elements, each resistive element in the second pair having a first terminal coupled to the respective bonding pad of the second pair of bonding pads and a second terminal coupled to the second terminal of the resistive element in the second pair of resistive elements.
4 more elements
A method of testing an electronic device, the electronic device having an electrical component subdivided into at least two identical components, each identical component having first and second terminals;
- a first pin associated with each pair of the first terminals and a second pin associated with each pair of the second terminals;
- a first pair of bonding pads, each coupled to the respective first terminal of the at least two identical components and further coupled to the first pin;
- a second pair of bonding pads, each coupled to the respective second terminal of the at least two identical components and further coupled to the second pin;
- a first pair of resistive elements, each resistive element having a first terminal coupled to a respective bonding pad of the first pair of bonding pads and a second terminal coupled to the second terminal of the other resistive element;
- and a second pair of resistive elements, each resistive element in the second pair having a first terminal coupled to the respective bonding pad of the second pair of bonding pads and a second terminal coupled to the second terminal of the resistive element in the second pair of resistive elements;
- the method comprising carrying out at least one resistance measurement between the first and the second pins.
3 more elements
An electronic device, comprising:
- four pins, each of the four pins connected to a respective pair of bonding pads by a respective double-wire bonding arranged in parallel with one another, the double-wire bonding bonded to the pins and to the pads;
- an output power transistor circuit comprising four identical transistors, each transistor having a source terminal connected to one of the bonding pads associated with one of the first and second pins respectively and a drain terminal connected to one of the bonding pads associated with the third and fourth pins, respectively;
- a first and second pair of resistive elements, each resistive element having a first terminal coupled to the respective bonding pad to the first and second pins and a second terminal coupled to the second terminal of the other resistive elements;
- and
- a third and a fourth pair of resistive elements, each resistive element having a first terminal coupled to the respective bonding pad of the third and fourth pins, and a second terminal coupled to the second terminal of the other resistive elements in the third and fourth pair of resistive elements.
2 more elements
A method of testing an electronic circuit, the electronic circuit having four pins, each of the pins connected to a respective pair of bonding pad by respective double-wire bonding arranged in parallel with one another, the double-wire bonding bonded to the pins and to the pads;
- an output power transistor circuit comprising four identical transistors, each transistor having a source terminal connected to a bonding pad associated with one of the first and second pins respectively and a drain terminal connected to a bonding pad associated with the third and fourth pins, respectively;
- a first and second pair of resistive elements, each resistive element having a first terminal coupled to a respective bonding pad to the first and second pins and a second terminal coupled to the second terminal of the other resistive elements;
- and a third and a fourth pair of resistive elements, each resistive element having a first terminal coupled to a respective bonding pad of the third and fourth pins, and a second terminal coupled to the second terminal of the other resistive elements in the third and fourth pair of resistive elements;
- the method comprising:
- carrying out at least one resistance measurement between the first and second pins and the third and fourth pins.
2 more elements
Dependencies are inferred from the claim text.