Semiconductor device, display device, and method for producing a semiconductor device
AssigneesSharp Kabushiki Kaisha, Semiconductor Energy Laboratory Co., Ltd.
InventorsYASUSHI KUBOTA, ICHIRO SHIRAKI, TAMOTSU SAKAI, ZHANG HONGYONG, JUN KOYAMA
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Abstract
A semiconductor device includes a first conductive layer; an interlayer insulative layer having an opening; and a second conductive layer. The first conductive layer, the interlayer insulative layer and the second conductive layer are sequentially laminated. The opening is partially covered by the second conductive layer, and an area of the first conductive layer is substantially entirely covered by the second conductive layer in the opening.
Claims13
A semiconductor device, comprising:
- a first conductive layer;
- an interlayer insulative layer having an opening;
- and
- a second conductive layer,
- wherein:
- the first conductive layer, the interlayer insulative layer and the second conductive layer are sequentially laminated, and the second conductive layer is connected to the first conductive layer through the opening, and
- the opening is partially covered by the second conductive layer, and an area of the first conductive layer is substantially entirely covered by the second conductive layer in the opening.
A method for producing a semiconductor device, comprising the steps of:
- forming a first conductive layer;
- forming an interlayer insulative layer on the first conductive layer and forming an opening in the interlayer insulative layer;
- forming a second conductive layer on the first conductive layer so as to cover the interlayer insulative layer;
- and
- patterning the second conductive layer,
- wherein the step of patterning the second conductive layer also patterns an area of the first conductive layer located in the opening.
A display device having a connection structure, the connection structure comprising:
- a first conductive layer;
- an interlayer insulative layer having an opening;
- and
- a second conductive layer,
- wherein:
- the first conductive layer, the interlayer insulative layer and the second conductive layer are sequentially laminated, and the second conductive layer is connected to the first conductive layer through the opening, and
- the opening is partially covered by the second conductive layer, and an area of the first conductive layer is substantially entirely covered by the second conductive layer in the opening.
Dependencies are inferred from the claim text.