Semiconductor device measuring socket capable of adjusting contact positions, and semiconductor device manufacturing method using the same

A method for manufacturing a semiconductor device, comprising a step for measuring said semiconductor device by employing a semiconductor device measuring socket having:

• a wiring pattern board on which a test circuit is formed;
• a substantially S-shaped contact for electrically connecting said wiring pattern board to external leads arrayed on a semiconductor device;
• a supporting member for elastically supporting said contact under tiltable condition;
• a socket main body for storing thereinto said contact and said supporting member and for mounting said wiring pattern board on a lower portion of said socket main body;
• wherein:
• a step for adjusting a tilting amount of said contact by employing adjusting means provided on said semiconductor device measuring socket is executed before said semiconductor device measuring step in such a case that when said wiring pattern board is mounted on said socket main body, a lower end portion of said contact which is projected from the lower surface of said socket main body is depressed by said wiring pattern board to thereby tilt said contact, whereby a contact position between said external lead and said contact is determined.