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AssigneesHitachi, Ltd., Shin-Kobe Electric Machinery Co., Ltd.
InventorsAkira Nagai, Masayuki Noda
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The present invention provides a resin compound, which causes very little thermal stress even when a flip chip is mounted, is of low elastic modulus, and has high heat resistance enough for solder floating at 300° C., and also an adhesive film, metal-clad adhesive film, circuit board, and assembly structure using the resin compound. The present invention is a resin compound containing (A) polyamide imide with siloxane bond, (B) acrylic polymer with weight-average molecular weight of 500,000 or more, (C) thermoset resin, and (D) solvent; an adhesive film and a metal-clad adhesive film using the resin compound; and also a circuit board and an assembly structure made with these films.
A resin compound containing (A) polyamide imide with siloxane bond, (B) acrylic polymer with weight-average molecular weight of 500,000 or more, (C) thermoset resin, and (D) solvent.
An adhesive film having a resin compound containing (A) polyamide imide with siloxane bond, (B) acrylic polymer with weight-average molecular weight of 500,000 or more, and (C) thermoset resin.
A metal-clad adhesive film comprising a resin insulation layer, containing (A) polyamide imide with siloxane bond, (B) acrylic polymer with weight-average molecular weight of 500,000 or more, and (C) thermoset resin, and a metal.
A circuit board of a build-up structure on which there is arranged an adhesive film having a resin compound containing (A) polyamide imide with siloxane bond, (B) acrylic polymer with weight-average molecular weight of 500,000 or more, and (C) thermoset resin, said circuit board being electrically connected to external terminals.
An assembly structure in which there is arranged an adhesive film having a resin compound containing (A) polyamide imide with siloxane bond, (B) acrylic polymer with weight-average molecular weight of 500,000 or more, and (C) thermoset resin on a circuit board of a build-up structure, said circuit board being electrically connected to external terminals, and a flip chip is mounted on the circuit board via the external terminals.
Dependencies are inferred from the claim text.