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US 2001/0018985 A1Published application
High-frequency circuit board and method of producing the same
AssigneesStanley Electric Co., Ltd., Meito Densan Co., Ltd.
InventorsMasayuki Kanechika, Hideki Urabe, Yoshio Kuriyama
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Abstract
A high-frequency circuit board free from variations in transmission impedance and having the desired characteristics is produced. A surface of a resin substrate is activated to form a roughened surface, and a thin-wall pattern of an electrically conductive metal is formed directly on the roughened surface of the resin substrate.
Claims7
A high-frequency circuit board comprising:
- a resin substrate having a surface activated to form a roughened surface;
- and
- a thin-wall pattern of an electrically conductive metal formed directly on the roughened surface of said resin substrate.
A method of producing a high-frequency circuit board, comprising the steps of:
- activating a surface of a resin substrate to form a roughened surface;
- and
- forming a thin-wall pattern of an electrically conductive metal directly on the roughened surface of said resin substrate.
A method of producing a high-frequency circuit board, comprising the steps of:
- preparing a resin substrate having copper foil provided on a surface thereof;
- removing the copper foil from said resin substrate to expose said surface;
- and
- forming a thin-wall pattern of an electrically conductive metal directly on the exposed surface of said resin substrate.
1 more element
Dependencies are inferred from the claim text.